2016
DOI: 10.1016/j.matchar.2016.09.020
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A study of the deformation and failure mechanisms of protective intermetallic coatings on AZ91 Mg alloys using microcantilever bending

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Cited by 14 publications
(7 citation statements)
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“…Various micro-mechanical testing techniques have been developed to characterize interfacial adhesion. Nanoindentation [ 8 , 9 , 10 , 11 , 12 ], nanoscratch [ 13 , 14 ], and micro-cantilever (MC) and micro-bridge (MB) bending [ 7 , 15 , 16 , 17 , 18 ] are widely used. From these, nanoscratch is considered to be a semi-quantitative approach [ 19 ], whereas top-surface nanoindentation has been used to measure the interfacial strength and toughness of a stiff dielectric film attached onto a comparatively ductile semiconductor substrate [ 19 , 20 ].…”
Section: Introductionmentioning
confidence: 99%
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“…Various micro-mechanical testing techniques have been developed to characterize interfacial adhesion. Nanoindentation [ 8 , 9 , 10 , 11 , 12 ], nanoscratch [ 13 , 14 ], and micro-cantilever (MC) and micro-bridge (MB) bending [ 7 , 15 , 16 , 17 , 18 ] are widely used. From these, nanoscratch is considered to be a semi-quantitative approach [ 19 ], whereas top-surface nanoindentation has been used to measure the interfacial strength and toughness of a stiff dielectric film attached onto a comparatively ductile semiconductor substrate [ 19 , 20 ].…”
Section: Introductionmentioning
confidence: 99%
“…MC and MB bending tests have been used to evaluate interfacial toughness, both applicable to embedded interfaces [ 7 , 15 , 17 ]. However, the suitability of MC and MB bending is limited to the interface of a stiff film on an ideally stiff substrate [ 18 ], as bending induced plastic deformation in ductile layers could prevent interfacial delamination from occurring or introduce additional complexity and substantial error to the analysis [ 21 ]. Hence, an interfacial adhesion quantification technique that can cope with plasticity is badly needed.…”
Section: Introductionmentioning
confidence: 99%
“…A limited number of studies have applied the indentation of fabricated microscale structures to investigate interfaces [17,28]. Matoy et al [29], Hirakata et al [30], and Chan et al [31], used notched MC configurations to initiate delamination of SiO/W and SiO/Cu, Sn/Si, and Zr/hydride interfaces, respectively.…”
Section: Introductionmentioning
confidence: 99%
“…Among all these processes, the most popular technique is micromechanical testing of focused ion beam (FIB) milled miniature structures [8,9]. Some examples of studies that this technique to identify the mechanical properties of coatings were performed by Lu et al [7,10] After that, the experimental methodology of the project will be discussed. Then, the experimental results of the project will be revealed and discussed in the next session.…”
Section: Motivation and Problem Definitionmentioning
confidence: 99%
“…Microcantilevers and microbridges are currently widely used to measure the mechanical properties of coating materials by performing bending tests [31]. Microcantilevers can be manufactured by cutting and removing the coating material with tools such as focused ion beams (FIB) [7,10] and electrified saws and wires [32]. Or by additive methods such as photolithography, electroplating, and anodizing followed by chemical etching to remove any unnecessary material [30].…”
Section: Bending Of Microcantilevers/microbridgesmentioning
confidence: 99%