2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) 2023
DOI: 10.1109/ectc51909.2023.00151
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A Study on the Advanced Chip to Wafer Stack for Better Thermal Dissipation of High Bandwidth Memory

S.-H. Lee
1
,
Jin-Woo Park
2
,
Jeong-Tak Moon
3
et al.
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Cited by 6 publications
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Demonstration of Low Temperature Cu-Cu Hybrid Bonding using A Novel Thin Polymer

Kayaba,
Shikama,
Okada
et al. 2024
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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Demonstration of Low Temperature Cu-Cu Hybrid Bonding using A Novel Thin Polymer

Kayaba,
Shikama,
Okada
et al. 2024
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
0
0
0
0
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Structural Characterization of 2.5D System in Package Combined with High Bandwidth Memory for Enhanced Quality and Reliability

Lee,
Choi,
Lee
et al. 2024
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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Novel sheet molding compound technology for wafer-level packaging to overcome wafer warpage issue

Sugiura,
Mori,
Fujii
et al. 2024
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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