“…Among these fabrication technologies, CMOS-MEMS approach exploits the standard commercial semiconductor process platforms to implement micro sensors and actuators, and hence the mature semiconductor technologies and supply chain can be leveraged to effectively reduce the time and efforts for commercialization. Numerous CMOS-MEMS devices have been demonstrated using different commercial platforms, for example, the tactile sensor [31], magnetic sensor [32] and accelerometer [33] from the TSMC (Taiwan Semiconductor Manufacturing Co., Taiwan) 2P4M (in this review: 'P' and 'M' respectively stand for 'Poly-Si' and 'Metal', '2P4M' means the process consisted of two poly-Si and four metal layers) standard process shown in figure 1(a), the gyroscope [34], microphones [35] and tactile sensors [36] from the TSMC 1P6M process displayed in figure 1(b), and the RF devices [37,38] and fingerprint sensors [39] from the UMC (United Microelectronics Co., Taiwan) 0.18 µm 1P6M CMOS process depicted in figure 1(c). By using the existing CMOS platforms, many environmental sensing chips have also been developed, which include sensors for the detection of temperature, pressure, IR, gas, PM 2.5 [40], etc.…”