2011
DOI: 10.4236/msa.2011.29175
|View full text |Cite
|
Sign up to set email alerts
|

A Top-Down Approach of Making Sn-3.5Ag Nanosolder Alloy by Swirl Method

Abstract: The nanoparticles of tin-silver solder, Sn-3.5Ag, of necklace geometry were made in a swirl batch. It was found that the addition of the element, Ag, did not vary the microstructure of the solder matrix, but Ag simply diluted into the Sn matrix randomly. The swirl flow facilitated the formation of particles with different sizes. It was found that the size distribution of the nanoparticles was strongly related to the height in the swirl batch. In addition, the aggregation of the nanoparticles was explored and t… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3

Citation Types

0
3
0

Year Published

2015
2015
2015
2015

Publication Types

Select...
2

Relationship

0
2

Authors

Journals

citations
Cited by 2 publications
(3 citation statements)
references
References 15 publications
0
3
0
Order By: Relevance
“…The most popular one is tin/silver/ copper (Sn/Ag/Cu) nanoparticles, which can be synthesized through a chemical reduction method [12][13][14] or electrodeposition method [15]. Some other lead-free nanosolder systems include Sn nanosolder particles [16], Sn/Ag alloy nanosolder particles [17,9,18,19] or nanowires [20,21], and Sn-Cu-Bi nanosolder particles [22], etc.…”
Section: Introductionmentioning
confidence: 99%
“…The most popular one is tin/silver/ copper (Sn/Ag/Cu) nanoparticles, which can be synthesized through a chemical reduction method [12][13][14] or electrodeposition method [15]. Some other lead-free nanosolder systems include Sn nanosolder particles [16], Sn/Ag alloy nanosolder particles [17,9,18,19] or nanowires [20,21], and Sn-Cu-Bi nanosolder particles [22], etc.…”
Section: Introductionmentioning
confidence: 99%
“…Sn‐Ag‐Cu (SAC) alloys are used in solder applications, printed circuit boards, and dental fillings . Historically, 63%Sn‐37%Pb alloy was extensively used in the microelectronics industry .…”
Section: Introductionmentioning
confidence: 99%
“…Sn‐Ag‐Cu (SAC) alloys are used in solder applications, printed circuit boards, and dental fillings . Historically, 63%Sn‐37%Pb alloy was extensively used in the microelectronics industry . However, due to the toxicity and environmental impacts of lead, the US and EU countries have banned lead‐containing solders .…”
Section: Introductionmentioning
confidence: 99%