T he emerging demand for high-capacity wireless mobile communication and the advent of the Internet of Things and fifthgeneration communication standards have motivated the development of high-performance transceivers. The power amplifier (PA) is the most critical part in the transmit path and dominates the transceiver's performance, including coverage range, data rate, spectrum compliance, and dc power dissipation. Integration capability and the relatively low cost of complementary-metal-oxide-semiconductor (CMOS) technology, on the other hand, have propelled it into the wireless market. CMOS technology enables complete system-on-chip solutions, resulting in ), Yingheng Tang (tang96@purdue.edu), and Saeed Mohammadi (saeedm@purdue.edu) are with the Birck Nanotechnology Center, Purdue University West Lafayette, Indiana, United States.im ag e lic en se d by in gr am pu bl is hi ng