2014 IEEE 26th International Symposium on Power Semiconductor Devices &Amp; IC's (ISPSD) 2014
DOI: 10.1109/ispsd.2014.6856064
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A wide bandgap silicon carbide (SiC) gate driver for high-temperature and high-voltage applications

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Cited by 40 publications
(12 citation statements)
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“…The SiC technology is surely becoming a reliable and relevant alternative to silicon and it is in power electronics that this can be seen most clearly [22]. Leading companies around the world have created specialized manufacturing facilities for SiC power semiconductor devices.…”
Section: Recent Advances In Silicon Carbide Technologymentioning
confidence: 99%
“…The SiC technology is surely becoming a reliable and relevant alternative to silicon and it is in power electronics that this can be seen most clearly [22]. Leading companies around the world have created specialized manufacturing facilities for SiC power semiconductor devices.…”
Section: Recent Advances In Silicon Carbide Technologymentioning
confidence: 99%
“…Although SOI technology can be used to develop applications of high‐temperature gate driver integrated circuit, its complex fabrication processes increase fabrication costs, which makes the high price of driven chips based on SOI technology. The gate driver integrated circuits' temperature can reach 400°C–500°C by using the SiC IC fabrication process [17–21]. The maximum temperature of the undervoltage protection circuit that is proposed by the 4H SiC IC fabrication process is 300°C [22].…”
Section: Introductionmentioning
confidence: 99%
“…This eliminates the necessity for extra cooling, protection and passive devices. This, in turn, will maximize power density by lowering the board area, wire routing lengths, parasitics, power loss and cost in high voltage and high power systems [6].…”
Section: Introductionmentioning
confidence: 99%