A Wide Range and High Repeatability MEMS Pressure Sensor Based on Graphene

Zhu, Zehua; Wang, Junqiang; Wu, Chenyang; Chen, Xuwen; Liu, Xiaofei; Li, Mengwei

doi:10.1109/jsen.2022.3195231

Cited by 9 publications

(1 citation statement)

References 56 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Then, the allotropes of carbon, such as carbon nanotubes (CNTs) and graphene, can be deposited onto the predetermined regions to produce desirable piezoresistors. Zhu et al transferred a single-layer chemical vapor deposition graphene to the edge of a Si-sensing diaphragm to realize a high-repeatability graphene pressure sensor [ 89 ]. With protection from a Si 3 N 4 nanofilm, the obtained device achieved a sensitivity of 5.51 × 10 −5 /kPa, repeatability error of 4.062%FS, and hysteresis of 2.118%FS, which is better than many typical graphene pressure sensors.…”

Section: Contributions Of New Materialsmentioning

confidence: 99%

Structural Engineering in Piezoresistive Micropressure Sensors: A Focused Review

Liu¹,

Jiang

Yang³

et al. 2023

Micromachines

View full text Add to dashboard Cite

The longstanding demands for micropressure detection in commercial and industrial applications have led to the rapid development of relevant sensors. As a type of long-term favored device based on microelectromechanical system technology, the piezoresistive micropressure sensor has become a powerful measuring platform owing to its simple operational principle, favorable sensitivity and accuracy, mature fabrication, and low cost. Structural engineering in the sensing diaphragm and piezoresistor serves as a core issue in the construction of the micropressure sensor and undertakes the task of promoting the overall performance for the device. This paper focuses on the representative structural engineering in the development of the piezoresistive micropressure sensor, largely concerning the trade-off between measurement sensitivity and nonlinearity. Functional elements on the top and bottom layers of the diaphragm are summarized, and the influences of the shapes and arrangements of the piezoresistors are also discussed. The addition of new materials endows the research with possible solutions for applications in harsh environments. A prediction for future tends is presented, including emerging advances in materials science and micromachining techniques that will help the sensor become a stronger participant for the upcoming sensor epoch.

show abstract

Section: Contributions Of New Materialsmentioning

confidence: 99%

Structural Engineering in Piezoresistive Micropressure Sensors: A Focused Review

Liu¹,

Jiang

Yang³

et al. 2023

Micromachines

View full text Add to dashboard Cite

show abstract

The Roadmap of 2D Materials and Devices Toward Chips

Liu,

Zhang,

Liu

et al. 2024

Nano-Micro Lett.

View full text Add to dashboard Cite

Due to the constraints imposed by physical effects and performance degradation, silicon-based chip technology is facing certain limitations in sustaining the advancement of Moore’s law. Two-dimensional (2D) materials have emerged as highly promising candidates for the post-Moore era, offering significant potential in domains such as integrated circuits and next-generation computing. Here, in this review, the progress of 2D semiconductors in process engineering and various electronic applications are summarized. A careful introduction of material synthesis, transistor engineering focused on device configuration, dielectric engineering, contact engineering, and material integration are given first. Then 2D transistors for certain electronic applications including digital and analog circuits, heterogeneous integration chips, and sensing circuits are discussed. Moreover, several promising applications (artificial intelligence chips and quantum chips) based on specific mechanism devices are introduced. Finally, the challenges for 2D materials encountered in achieving circuit-level or system-level applications are analyzed, and potential development pathways or roadmaps are further speculated and outlooked.

show abstract