a broad spectrum of applications due to their unique characteristics such as high mechanical flexibility, low cost, and scalable manufacturing. [1][2][3][4] However, many of the materials and processes used in PE devices often depend on nonbiodegradable polymer supporting substrates (such as silicone elastomers, polyethylene terephthalate, polyimide, etc.). [5][6][7][8][9] Considering the widespread implementation of PE, spanning from soft robots, human-machine interface, and flexible displays to advanced healthcare and virtual reality in the near future, the buildup of discarded electronic waste (e-waste) will cause adverse environmental effects. Recently, the United Nations has reported that by 2030 e-waste will grow up to 74 million metric tons on the planet, which will demand extensive landfill space for its appropriate disposal or recycling. [10] Therefore, researchers and scientists are highly inspired to find sustainable substitutes with the desired characteristics to address the concerns mentioned above.Recently, paper-based transient bioelectronics (PTB) composed of biodegradable materials have emerged as a new class of technology that can fully degrade to benign and environmentally safe by-products after they have served their primary function. [11][12][13][14] Despite the known bioresorbable characteristics of the paper substrates in PTB, the conductive traces and circuitry in these devices must be made from highly conductive and bioresorbable materials through Paper-based electronics are emerging as a new class of technology with broad areas of application. Despite several efforts to fabricate new types of flexible electronic devices by screen printing of conductive paste, many of them are often nonbiodegradable, toxic, and expensive, limiting their practical use in bioresorbable paper-based electronics. To address this need, a highly conductive and biodegradable bimodal conductive paste is developed using cost-effective zinc-based micro and nanoparticles with a facile low-temperature sintering process compatible with paper substrates. The two-step sintering process involves the removal of the insulating zinc oxide layer by spray coating acetic acid followed by a heat press sintering process to ensure the formation of highly packed and continuous metallic traces. The required conditions for the heat press sintering process are systematically studied using electrical, optical, and mechanical characterization techniques. The results of these investigations revealed an ultra-packed microstructure with high electrical conductivity (0.5 × 10 5 S m −1 ) and low oxide content that is obtained with a heat press sintering setting of 220 °C for 60 s. Finally, as a proof of concept, the conductive paste with an optimized sintering process is used to fabricate a wearable wireless heater for remote-controlled release of therapeutics. The controlled delivery of the system is validated in the practical and on-demand delivery of antibiotics for eradicating commonly found bacteria such as Staphylococcus aureus in derm...