Access to Fluorinated Polymer Surfaces with Outstanding Mechanical Property, High Optical Transparency, and Low Surface Energy via Nonafluoro-<i>tert</i>-Butyl Group Introduction

Han, Dong Je; Kim, Seonwoo; Heo, Hyeon; Park, In Jun; Kang, Hyeonbae; Lee, Sang Goo; Lee, Jong-Chan; Sohn, Eun‐Ho

doi:10.1021/acsapm.0c00625

Cited by 6 publications

(1 citation statement)

References 59 publications

(108 reference statements)

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“…It has been reported that incorporating fluoro-containing moieties can reduce the dielectric constant and enhance hydrophobicity. ,,− Note that hydrophobicity is important for electronic materials since the D k value of water is about 80 at room temperature, therefore moisture absorption of a thermoset has a negative effect on dielectric constant. Among the fluoro-containing moieties, we focus on the symmetric tetrafluorophenylene moiety that will not increase the dipole moment due to an equal distribution of polarizable C–F bonds.…”

Section: Introductionmentioning

confidence: 99%

Tetrafluorophenylene-Containing Vinylbenzyl Ether-Terminated Oligo(2,6-dimethyl-1,4-phenylene ether) with Better Thermal, Dielectric, and Flame-Retardant Properties for Application in High-Frequency Communication

et al. 2022

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In an integrated circuit, signal propagation loss is proportional to the frequency, dissipation factor ( D f ), and square root of dielectric constant ( D k ). The loss becomes obvious as we move to high-frequency communication. Therefore, a polymer having low D k and D f is critical for copper-clad laminates at higher frequencies. For this purpose, a 4-vinylbenzyl ether phenoxy-2,3,5,6-tetrafluorophenylene-terminated OPE (VT-OPE) resin was synthesized and its properties were compared with the thermoset of commercial OPE-2St resin. The thermoset of VT-OPE shows a higher T g (242 vs 229 °C), a relatively high cross-linking density (1.59 vs 1.41 mmole cm –3 ), a lower coefficient of thermal expansion (55 vs 76 ppm/°C), better dielectric characteristic at 10 GHz ( D k values of 2.58 vs 2.75, D f values of 0.005 vs 0.006), lower water absorption (0.135 vs 0.312 wt %), and better flame retardancy (UL-94 VTM-0 vs VTM-1 with dropping seriously) than the thermoset of OPE-2St. To verify the practicability of VT-OPE for copper-clad laminate, a laboratory process was also performed to prepare a copper-clad laminate, which shows a high peeling strength with copper foil (5.5 lb/in), high thermal reliability with a solder dipping test at 288 °C (>600 s), and the time for delamination of the laminate in thermal mechanical analysis (TMA) at 288 °C is over 60 min.

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Section: Introductionmentioning

confidence: 99%

Tetrafluorophenylene-Containing Vinylbenzyl Ether-Terminated Oligo(2,6-dimethyl-1,4-phenylene ether) with Better Thermal, Dielectric, and Flame-Retardant Properties for Application in High-Frequency Communication

et al. 2022

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The crosslinking and decrosslinking of fluorinated diblock copolymer from RAFT emulsion polymerization toward surface anti‐icing

Xu,

Qiu,

Tian

et al. 2024

Journal of Polymer Science

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Here, we demonstrate disulfide‐crosslinked polyfluoroacrylate AB block copolymer films with excellent anti‐icing properties. The fluorinated latexes of AB block copolymers were synthesized via two‐step reversible addition‐fragmentation chain‐transfer (RAFT) emulsion polymerization using polyacrylic acid and its sodium salts as the hydrophilic A‐block, and polyhexafluorobutyl acrylate as the hydrophobic B‐block. Diacetone acrylamide was copolymerized in different blocks as a crosslinking anchor. A disulfide‐containing compound dithiodipropionic acid dihydrazide was chosen as the crosslinking agent to form disulfide‐crosslinked fluorinated films to enhance the mechanical properties, surface properties, swelling properties, and anti‐icing properties of the films. It has proved that the crosslinking site has a great impact on the film formation process which in turn affects the film performance. The B‐block crosslinked films showed better resistance to water while the A‐block crosslinked films were more organic solution resistant. The A‐block crosslinked films also possessed better anti‐icing properties due to the high F/O value. Furthermore, decrosslinking experiments were conducted using a reductant tris(2‐carboxyethyl)phosphine hydrochloride to break the disulfide bond. The recycling rate of the B‐block crosslinked films could reach >90% while the recycling rate of the A‐block crosslinked films reached >75%.

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Poly(vinylidene fluoride)-based film with strong antimicrobial activity

Han

Kim

Heo

et al. 2021

Applied Surface Science

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Access to Fluorinated Polymer Surfaces with Outstanding Mechanical Property, High Optical Transparency, and Low Surface Energy via Nonafluoro-tert-Butyl Group Introduction

Cited by 6 publications

References 59 publications

Tetrafluorophenylene-Containing Vinylbenzyl Ether-Terminated Oligo(2,6-dimethyl-1,4-phenylene ether) with Better Thermal, Dielectric, and Flame-Retardant Properties for Application in High-Frequency Communication

Tetrafluorophenylene-Containing Vinylbenzyl Ether-Terminated Oligo(2,6-dimethyl-1,4-phenylene ether) with Better Thermal, Dielectric, and Flame-Retardant Properties for Application in High-Frequency Communication

The crosslinking and decrosslinking of fluorinated diblock copolymer from RAFT emulsion polymerization toward surface anti‐icing

Poly(vinylidene fluoride)-based film with strong antimicrobial activity

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