Acid Components in Outgassing from F2 Resists: A Study Using In-Situ QCM Technique

Shirai, Masamitsu; Takashiba, Shinichi; Horiguchi, Yusuke; Irie, Shigeo; Itani, T.

doi:10.2494/photopolymer.17.645

Cited by 3 publications

(3 citation statements)

References 10 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…We suspect film thickness reductions are attributable to deprotection reactions in the resist. To confirm this, we performed an experiment: Using the same resist, we performed QCM measurements [9] during the exposures to determine the relationship between exposure dose and film thickness. Fig.…”

Section: Relationship Between Deprotection Reaction and Amount Of Filmentioning

confidence: 97%

Calculating development parameters for chemically amplified resists by the film-reducing method

Sekiguchi

Sensu

2013

SPIE Proceedings

View full text Add to dashboard Cite

Section: Relationship Between Deprotection Reaction and Amount Of Filmentioning

confidence: 97%

Calculating development parameters for chemically amplified resists by the film-reducing method

Sekiguchi

Sensu

2013

SPIE Proceedings

View full text Add to dashboard Cite

“…Using a resist that undergoes cross-linking and changes from a liquid to a solid when exposed to light, we measured changes in impedance by the QCM method [1][2][3][4][5][6][7][8] while exposing the resist to light. In this experiment, exposure induced photocrosslinking and a change from liquid to solid in the resin.…”

Section: Methods For Measurementmentioning

confidence: 99%

Study of Swelling Behavior in ArF Resist during Development by the QCM Method (3) - Observations of Swelling Layer Elastic Modulus -

Sekiguchi

2013

J. Photopol. Sci. Technol.

View full text Add to dashboard Cite

The QCM method allows measurements of impedance, an index of swelling layer viscosity in a photoresist during development. While impedance is sometimes used as a qualitative index of change in the viscosity of the swelling layer, it has not so far been used quantitatively, for data analysis. We explored a method for converting impedance values to elastic modulus (Pa) and a coefficient expressing viscosity. Applying this method, we compared changes in the viscosity of the swelling layer in an ArF resist generated during development in a TMAH developing solution and in a TBAH developing solution. This paper reports the results of this comparative study.

show abstract

“…Many reports have discussed on the swelling behavior of photoresists during development, as observed by the QCM method. [1][2][3][4][5][6][7] Previously, we reported on the development of development analysis equipment based on the QCM method. [8] In this paper, we report on a high-precision resist development analyzer also based on the QCM method.…”

mentioning

confidence: 99%

Observation of Swelling Behavior of ArF Resist during Development by using QCM Method (2)

Sekiguchi

Konishi

Isono

2012

J. Photopol. Sci. Technol.

View full text Add to dashboard Cite

Many reports have discussed the swelling behavior of photoresists during development, as observed by the QCM method. Previously, we reported on the development of development analysis equipment based on the QCM method. In this paper, we report on a high-precision resist development analyzer also based on the QCM method. This equipment incorporates a high-precision developing solution temperature controller and features a high-precision air conditioning function for the measurement chamber. We also measured swelling behavior during development using a TBAH developer solution, which features larger molecules than TMAH, comparing these results with those obtained with TMAH. The results of this measurement indicate that the extent of resist swelling during development is less with TBAH developer solution than with TMAH developer solution. This result is consistent with results of a study by Itani et al. using high-speed AFM, suggesting the suitability of the measurement equipment used in our experiments.

show abstract

Acid Components in Outgassing from F2 Resists: A Study Using In-Situ QCM Technique

Cited by 3 publications

References 10 publications

Calculating development parameters for chemically amplified resists by the film-reducing method

Calculating development parameters for chemically amplified resists by the film-reducing method

Study of Swelling Behavior in ArF Resist during Development by the QCM Method (3) - Observations of Swelling Layer Elastic Modulus -

Observation of Swelling Behavior of ArF Resist during Development by using QCM Method (2)

Contact Info

Product

Resources

About