Additive-effects during plating in acid tin methanesulfonate electrolytes

Martyak, Nichölas M.; Seefeldt, Robert

doi:10.1016/j.electacta.2004.03.039

Cited by 86 publications

(69 citation statements)

References 9 publications

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“…It was reported that the presence of 100 mg dm -3 chloride ions in the electroplating baths has a negligible effect on stannous ion reduction. 51 The chloride ion had little effect on the thickness at a given current density and the surface morphology is similar. X-ray photoelectron spectroscopy showed that no residual chloride was attached to the surface of matte tin deposits.…”

Section: Electrolyte Additives and Operating Parametersmentioning

confidence: 91%

“…51 Non-ionic ethoxylated compounds, such as the Triton X series of surfactants, have proven popular for tin deposition. For example, the surfactant has helped to give a uniform, adherent and semi-bright tin or a uniform, adherent and semi bright tin deposit 43 but below 0.12 g dm -3 , the surfactant had no effect on the quality of tin deposit and dendrites were formed, Triton X-100 can result in deposition of needle-like structures of tin.…”

Section: Electrolyte Additives and Operating Parametersmentioning

confidence: 99%

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A review of developments in the electrodeposition of tin

Walsh

Low

2016

Surface and Coatings Technology

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Highlights Types of aqueous electrolytes for pure tin deposits are reviewed. The many existing and developing applications of tin deposits are summarised. Emphasis is placed on versatile methanesulfonic acid electrolytes. The effects of bath composition (including additives) and operating conditions on deposit morphology are illustrated. Electrochemical studies at static and controlled flow rotating electrodes are illustrated. AbstractThe importance of tin and its electrodeposition are summarised and the scope for plating tin is outlined.Established applications of electroplated tin include corrosion protection, electronics fabrication and cooking utensils. The past 20 years have seen developments in the science and technology of tin plating, including research into nanostructured deposits, adoption of environmentally friendly methanesulfonic acid baths and more ambitious coatings including multi-layers and composites. Our ability to tailor deposit structure and composition has been improved by newer electrolytes, pulse plating and electrolyte additives. The diversity of tin applications has extended to lithium batteries using newer structures (such as composites, multi-layers and nanostructures), electrical control (e.g., pulsed current) and relative bath/electrode movement (including the use of rotating electrodes). Electrochemical aspects of modern tin deposition are illustrated by data from the authors' laboratory which highlights the versatility of methanesulfonic acid electrolytes. A wide range of deposit morphology, colour and surface finish are possible by the use of suitable addition agents and control of electrode/electrolyte movement and operating conditions. Subject areas needing further research work are identified.

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Section: Electrolyte Additives and Operating Parametersmentioning

confidence: 91%

Section: Electrolyte Additives and Operating Parametersmentioning

confidence: 99%

A review of developments in the electrodeposition of tin

Walsh

Low

2016

Surface and Coatings Technology

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“…The effects of organic additives on the electrochemical and morphological deposit changes from acid tin methanesulfonate solutions have been considered by Martyak and Seefeldt [16]. In the absence of additives, tin deposition was diffusion-controlled, with concurrent hydrogen gas evolution and the tin deposits were rough.…”

Section: Randles-sevćikmentioning

confidence: 99%

Versatile electrochemical coatings and surface layers from aqueous methanesulfonic acid

Walsh

León

2014

Surface and Coatings Technology

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Ever tightening environmental pressure together with the continued need for coatings able to meet challenging service environments have stimulated advances in coating technology. In the case of electrochemical techniques, the classical techniques of electrodeposition and anodising are being upgraded to meet the need for modern surface engineering coatings (including nanostructured films) on metals. A major challenge is to retain conventional processing, including aqueous solutions, simple power supplies and existing electrolyte tanks while using cost effective, 'green' electrolytes. One successful direction has been the emergence of electrolytes based on methanesulfonic acid, MSA which has good electrolytic conductivity and is capable of dissolving many metals as well as acting as a useful medium for dispersion of solids prior to electrophoretic coating. A range of application methods result, including electroplating, anodising and electrophoretic deposition from a stable, aqueous sol. A diverse range of coating materials is emerging, including metals, alloys, porous metal oxide films, conductive polymers and many composites. This review illustrates the usefulness and applications of MSA electrolytes using recent examples from the authors' laboratories and others. Developing coatings, including alternating multilayers of Sn and Cu, nanostructured metals, hierarchical pores, nanotubular metal oxides and graphene composites are briefly considered. This is a review with 94 references.

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“…To maintain the stability of acid Sn(II) solutions, 1 mM of hydroquinone (HQ) was added. Special experiments and literature data (40,41) showed that such small amount of HQ exerts no tangible effect on the results obtained.…”

Section: Methodsmentioning

confidence: 99%

Surfactant Effects in Cu-Sn Alloy Deposition

et al. 2011

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Adsorption behavior of different polyethers (PE) on copper and tin was studied in combination with kinetic investigations. No pronounced effect of PE was detected in Cu|Cu(II) system. In contrast, these substances show a high inhibition activity on the tin electrode. Halides enhance adsorption ability on copper electrode but suppress it on tin; this effect intensifies in the sequence: Cl -< Br -< I -. The inhibition degree of surfactants increases with the length of hydrocarbon chain. Underpotential deposition of Sn(II) is observed in the region of Cu(II) limiting current. Deposits obtained present a mixture of pure copper, α-CuSn phase and hcp phase. The characteristic current minimum arises in the region where the free Sn phase becomes thermodynamically stable. Cl -ions broaden the range of current densities where yellow bronze can be obtained, but Br -ions show the opposite effect. Iodides retard the reduction of Cu(II) and tin prevails in the coatings.

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Additive-effects during plating in acid tin methanesulfonate electrolytes

Cited by 86 publications

References 9 publications

A review of developments in the electrodeposition of tin

A review of developments in the electrodeposition of tin

Versatile electrochemical coatings and surface layers from aqueous methanesulfonic acid

Surfactant Effects in Cu-Sn Alloy Deposition

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