Advanced cooling system using miniature heat pipes in mobile PC

Nguyen, Tien Dat; Mochizuki, Masahito; Mashiko, Koichi; Saito, Yuji; Sanciuc, I.; Boggs, R.

doi:10.1109/6144.833046

Cited by 33 publications

(7 citation statements)

References 1 publication

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Alternative investigations [7,8] used pulsating, synthetic micro-jets in the laminar regime to cool the processor chips in laptop computers, while others [9] used heat pipes to cool the laptop computers and encountered several design/manufacturing limitations due to the restrictions imposed by the increased miniaturization.…”

Section: Introductionmentioning

confidence: 99%

Comparison of 2D and 3D unsteady effects of a pair of opposed confined impinging jets

Chiriac¹,

Rosales

2010

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

View full text Add to dashboard Cite

The unsteady laminar flow and heat transfer characteristics for a pair of opposed confined impinging air jets in 2D and 3D were studied numerically. The present study continues the authors' earlier work [1] and identifies the main similarities and differences arising from the expansion to the third dimension.For comparison purposes, the space and time-averaged heat transfer coefficients for a pair of heat sources arranged at different locations on opposite target walls were determined together with the oscillating jet frequency. The authors' previous investigation found that opposite confined jets remain steady at Reynolds numbers that make the parallel (side-by-side) jets highly unsteady. The nature of the unsteadiness depends on the proximity of the jet inlets, the channel dimensions and the jet Reynolds number.The unsteadiness causes the stagnation point locations to sweep back and forth over the impingement region, causing the jets to "wash" a larger surface area on the target wall. Depending on the proximity of the jet inlets, a fixed stagnation "bubble" is formed between the two jets, leading to a quasi-independence of the local heat transfer on flow conditions.The study focuses on the flow field unsteadiness and associated heat transfer coefficients when varying the distance between the chips placed on the target walls for a flow at Re = 750. The relevant trends for the 2D and 3D jet hydrodynamic and thermal fields are documented.Although similar in nature, the unsteady 3D opposite jets produce results that deviate from the 2D unsteady opposite jets. The complex vortex patterns resulting from the jet interaction at the higher Reynolds number is investigated and its impact on electronics component cooling are documented.

show abstract

Section: Introductionmentioning

confidence: 99%

Comparison of 2D and 3D unsteady effects of a pair of opposed confined impinging jets

Chiriac¹,

Rosales

2010

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

View full text Add to dashboard Cite

show abstract

“…2 Theoretical analyze 2.1 Model specification Nguyen and Mochizuki [9] have tested the micro-channel on the hydraulic diameter of 540μm and 2.54mm, and conclusions showed that these dimensions of coolers had higher cooling capacity than the limit cooling capacity of air forced, and can meet the demands of heat for the next generation of chips. At the same time, the pressure dropped smaller at the both ends of the micro-channel with 2.54mm hydraulic diameter.…”

Section: Introductionmentioning

confidence: 99%

Numerical simulation on variable width multi-channels heat sinks with non-uniform heat source

Wang

Zhang

Liu

et al. 2009

2009 International Conference on Electronic Packaging Technology &Amp; High Density Packaging

View full text Add to dashboard Cite

The micro-channel heat sink (MCHS) is almost using a separate production of silicon or copper MCHS, which is indirectly on package dimensions. Using this package structure of the heat sink, the temperature of its central region is much higher than the surrounding region. It makes the surface of the hot load non-uniformly. At present, most of the studies have adopted the uniform thermal load, regardless of the way through trial or through the means of simulation. Traditional micro-channel has effects on treating the uniform thermal load, however, its structure needs to be further improved in order to reduce the hot concentrated caused by the non-uniformity. Few papers have done the research about the non-uniform heat source distributions. In this paper, the non-uniform heat source distributions are studied in the micro-channel heat sink (MCHS) cooler. The simulation model is established to analyze the temperature and pressure distributing of the MCHS with different channel widthdimensions. Water is chosen as the coolant for its superior hot properties and the velocity range is from 0.01m/s to 10m/s. With the simulation of the computation fluid dynamics software FLUENT, results show that the non-equal displacement of fins can effectively decrease the temperature rise under the same conditions cooling a non-uniform heat source.

show abstract

“…Mobile personal computer (PC) platform designs vary significantly from designer to designer [1][2][3][4]; however, the pursuit of the thinnest possible systems is a consistent trend across the mobile PC industry. The prevailing desire for z-height reduction drives the need for thinner internal components.…”

Section: Introductionmentioning

confidence: 99%

“…The second effect is that the load and pressure that can be generated between the silicon dice and the thermal solution tends to be limited, due to the reduced stiffness of the thin system components [13]. Figure 1(a) illustrates a representative thermal solution design (also known as, remote heat exchange) [1][2][3][4]. Remote heat exchange is the predominant design for cooling of high-powered SoC package and system components with dedicated active cooling.…”

Section: Introductionmentioning

confidence: 99%

Thermomechanical Interaction Between Thin Bare-Die Package and Thermal Solution in Next-Generation Mobile Computing Platforms

Uppal

Peterson

Chang

et al. 2019

Journal of Electronic Packaging

View full text Add to dashboard Cite

The demands for both thinner bare-die ball grid array (BGA) packages and thinner thermal solutions have added complexity for the thermal enabling design and material options associated with system on chip packages in mobile personal computer (PC) platforms. The thermomechanical interactions between the bare-die package and the thermal solution are very critical, creating the needs for: (1) an in-depth thermomechanical characterization to understand their impacts on product quality and performance and (2) a simple and yet robust modeling methodology to analyze design parameters using a commercially available software. In this paper, experimental metrologies and modeling methodology are developed with the details of contents documented. Validation of the newly developed tools and recommendation/guidance are also discussed for detailed assessments of thermomechanical tradeoffs for optimal design spaces for next-generation mobile platforms.

show abstract

Advanced cooling system using miniature heat pipes in mobile PC

Cited by 33 publications

References 1 publication

Comparison of 2D and 3D unsteady effects of a pair of opposed confined impinging jets

Comparison of 2D and 3D unsteady effects of a pair of opposed confined impinging jets

Numerical simulation on variable width multi-channels heat sinks with non-uniform heat source

Thermomechanical Interaction Between Thin Bare-Die Package and Thermal Solution in Next-Generation Mobile Computing Platforms

Contact Info

Product

Resources

About