Numerical simulation on variable width multi-channels heat sinks with non-uniform heat source

Abstract

The micro-channel heat sink (MCHS) is almost using a separate production of silicon or copper MCHS, which is indirectly on package dimensions. Using this package structure of the heat sink, the temperature of its central region is much higher than the surrounding region. It makes the surface of the hot load non-uniformly. At present, most of the studies have adopted the uniform thermal load, regardless of the way through trial or through the means of simulation. Traditional micro-channel has effects on treating the uniform thermal load, however, its structure needs to be further improved in order to reduce the hot concentrated caused by the non-uniformity. Few papers have done the research about the non-uniform heat source distributions. In this paper, the non-uniform heat source distributions are studied in the micro-channel heat sink (MCHS) cooler. The simulation model is established to analyze the temperature and pressure distributing of the MCHS with different channel widthdimensions. Water is chosen as the coolant for its superior hot properties and the velocity range is from 0.01m/s to 10m/s. With the simulation of the computation fluid dynamics software FLUENT, results show that the non-equal displacement of fins can effectively decrease the temperature rise under the same conditions cooling a non-uniform heat source.

Numerical simulation of thermal and hydraulic performance of a micro plate-pin fin heat sink

“…For this purpose, Hegde and Seetharamu [15] in 2008 explored the effects of various types of heat fluxes including upstream half heating, downstream half heating, center half heating and uniform heating throughout the base. Wang et al [16] in 2009 investigated three types of channel heat sinks with different hydraulic diameters. The results implied that decreasing the micro channel width causes the maximum temperature of the heat sink to decline and increases the pressure drop.…”

Liquid cooling of non-uniform heat flux of a chip circuit by subchannels

“…Their results demonstrated that a lower thermal resistance could be achieved by narrowing the channel above the hotspot. Numerical analysis of Minliang [11] and Wang [12] followed the same procedure i.e. narrowing the width of microchannels above the hotspot, to increase the fluid-solid interaction area.…”