Advanced thermal failure analysis and reliability investigations – Industrial demands and related limitations

Altes, A.; Tilgner, R.; Reissner, Markus; Steckert, G.; Neumann, Gerald

doi:10.1016/j.microrel.2008.06.020

Cited by 6 publications

(5 citation statements)

References 21 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The resistive thermal probe of the SThM is powered by an AC current I 0 sin(ut) with angular frequency u. As demonstrated earlier, 28,29 the probe can be considered in far-eld as a point like heat source and in close proximity as a line-shaped nanoscale heat source fullling the demands for high resolution near-eld microscopy 30 by generating a heat wave of frequency 2u with cylindrical symmetry. This wave will diffuse into the substrate and is exponentially damped in the radial direction.…”

Section: Methodsmentioning

confidence: 99%

From diffusive to ballistic Stefan–Boltzmann heat transport in thin non-crystalline films

et al. 2016

View full text Add to dashboard Cite

show abstract

Section: Methodsmentioning

confidence: 99%

From diffusive to ballistic Stefan–Boltzmann heat transport in thin non-crystalline films

et al. 2016

View full text Add to dashboard Cite

show abstract

“…In digital CMOS circuits for instance, the location of hot spots (devices operating with an abnormally high temperature) is usually correlated with the presence of a defect that may alter the functionality and performance of the circuit [14]. The temperature-based characterization strategy presents several advantages over other techniques: it provides an indirect way to observe the device's behavior without affecting its electrical characteristics because temperature sensors are electrically isolated from the CUT.…”

Section: Introductionmentioning

confidence: 99%

“…Temperature is a physical magnitude that is measured in integrated circuits (ICs) to extract information about the state and performance of operating devices via thermal mapping of the silicon surface, which is enabled by the linear dependence of the local temperature on the power dissipated by nearby devices. In digital CMOS circuits for instance, the location of hot spots (devices operating with an abnormally high temperature) is usually correlated with the presence of a defect that may alter the functionality and performance of the circuit [14]. The temperature-based characterization strategy presents several advantages over other techniques: it provides an indirect way to observe the device's behavior without affecting its electrical characteristics because temperature sensors are electrically isolated from the CUT.…”

Section: Introductionmentioning

confidence: 99%

Strategies for built-in characterization testing and performance monitoring of analog RF circuits with temperature measurements

Aldrete-Vidrio

Mateo

Altet

et al. 2010

Meas. Sci. Technol.

View full text Add to dashboard Cite

This paper presents two approaches to characterize RF circuits with built-in differential temperature measurements, namely the homodyne and heterodyne methods. Both non-invasive methods are analyzed theoretically and discussed with regard to the respective trade-offs associated with practical off-chip methodologies as well as on-chip measurement scenarios. Strategies are defined to extract the center frequency and 1 dB compression point of a narrow-band LNA operating around 1 GHz. The proposed techniques are experimentally demonstrated using a compact and efficient on-chip temperature sensor for built-in test purposes that has a power consumption of 15 μW and a layout area of 0.005 mm 2 in a 0.25 μm CMOS technology. Validating results from off-chip interferometer-based temperature measurements and conventional electrical characterization results are compared with the on-chip measurements, showing the capability of the techniques to estimate the center frequency and 1 dB compression point of the LNA with errors of approximately 6% and 0.5 dB, respectively.

show abstract

“…Recently, the complementarity of the methods for localisation and characterisation as well as the according industrial demands and related limitations have been shown [17]; techniques such as IR-LIT and thermal induced voltage alteration (TIVA), case studies and the capability of non-established techniques like scanning thermal microscopy (SThM), thermal reflectance microscopy (TRM) and time domain thermal reflectance (TDTR) are also presented and their impact on reliability investigations is discussed. It allows different kinds of thermal interaction mechanism to be utilised, which would normally have to be separated-for instance into classes with respect to thermal excitation and/or detection, spatial limitations and underlying physical principle.…”

Section: Techniques Of Failure Analysismentioning

confidence: 99%

Introduction

2011

Failure Analysis

View full text Add to dashboard Cite

Given the large range of possible human actions, many specific procedures of FA are needed, starting with medical procedures for curing or preventing diseases (which are failures of the human body) and continuing with various procedures for avoiding the failure of technical systems. In this respect, the word 'reliability' has two meanings: first, it is the aim of diminishing or removing failures, and second, it is the property of any system (human or artefact) to function without failures, in some given conditions and for a given duration. In fact, FA is a component of reliability analysis. This idea will be detailed in the following pages.From the above, one can see that the first goal of this book is to present the basics of FA, which is considered the key action for solving reliability issues. But there is a second purpose, equally important: to promote the idea of reliability, to show the importance of this discipline and the necessity of supporting its goals in achieving a given level of reliability as a key characteristic of any product.Unfortunately, the first reliability issues were solved by statisticians, which led to a mathematical approach to reliability, predominant in the first 25-30 years of the modern history of the domain. Today other disciplines, such as physics and chemistry, are equally involved. All this issues are detailed in Section 1.2, where a short history of reliability as a discipline is presented.The mathematical approach was restrictive and created the incorrect impression that the aim of reliability analysis was to impede the work of real specialists, forcing them to undertake redesigns due to cryptic results that nobody could understand. Today this misapprehension has generally been overcome, but its after-effects are still present in the mentality of some specialists. We want to persuade component manufacturers that reliability engineers are their best friends, simulating the behaviour of their product in real-life conditions and then recommending necessary improvements before the product can be sold. Manufacturers and reliability engineers must form a team, with information flowing in both directions.Even more importantly, this book is aimed at showing to industry managers the reasons for taking reliability issues into account from the design phase onwards, through the whole cycle of development of a product. It has been proved that the only way to promote reliability requirements is top-down, starting with the manager and continuing down to every worker.The third goal of the book starts from our subjective approach to reliability. We think reliability is a beautiful domain, offering immense satisfaction to any specialist, and involving a large range of knowledge, from physics, chemistry and mathematics to all engineering disciplines. That is why strong interdisciplinary teams are needed to solve reliability issues, which are difficult challenges for the human mind.We want to show to young readers the beauty of reliability analysis, which can be compared to a simple mathematical ...

show abstract

Advanced thermal failure analysis and reliability investigations – Industrial demands and related limitations

Cited by 6 publications

References 21 publications

From diffusive to ballistic Stefan–Boltzmann heat transport in thin non-crystalline films

From diffusive to ballistic Stefan–Boltzmann heat transport in thin non-crystalline films

Strategies for built-in characterization testing and performance monitoring of analog RF circuits with temperature measurements

Introduction

Contact Info

Product

Resources

About