2012
DOI: 10.1016/j.phpro.2012.10.072
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Advances in CO2-Laser Drilling of Glass Substrates

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Cited by 45 publications
(20 citation statements)
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“…There is no upper limit in achievable hole sizes and a typical roughness value, R a , is around 1 μm. Machining speed per hole differs from 30 μm/s [ 48 ] up to 2000 μm/s [ 13 ] depending on laser type and desired quality.…”
Section: Common Glass Micro-drilling Techniquesmentioning
confidence: 99%
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“…There is no upper limit in achievable hole sizes and a typical roughness value, R a , is around 1 μm. Machining speed per hole differs from 30 μm/s [ 48 ] up to 2000 μm/s [ 13 ] depending on laser type and desired quality.…”
Section: Common Glass Micro-drilling Techniquesmentioning
confidence: 99%
“…This causes a thermal impact on the glass and generates mechanical stress, which leads to crack formation during cooling. Many solutions are investigated to reduce this phenomenon, like local preheating of the workpiece, heating of the entire workpiece during drilling and thermal post-treatment of the drilled substrate using an oven [ 13 , 25 , 51 , 62 ]. In fact, smooth surfaces ( R a ~ several microns) are possible to achieve due to the generated heat [ 63 ].…”
Section: Common Glass Micro-drilling Techniquesmentioning
confidence: 99%
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“…Microchannel engraving has been demonstrated as a rapid fabrication method for microfluidic devices [ 5 , 6 ]. Laser drilling, termed ablation, of a single spot is another conventional technique to generate an array of microstructures, i.e., concavities or through-holes applied in many industrial and research applications [ 7 , 8 ]. Combined with the use of different substrate materials, a wide range of downstream tissue or cellular-based utilities can be readily achieved [ 3 , 9 , 10 , 11 ].…”
Section: Introductionmentioning
confidence: 99%
“…The primary reason for fabricating a limited number of glass valves in these studies was the difficulty of fabricating hundreds of micro-through-holes in the small area of a thin glass slide. Usually, through-glass through-holes can be produced using deep wet, dry, or deep neutral loop discharge plasma (Deep NLD) etching [ 30 , 31 , 32 ], blasting [ 33 , 34 ] laser drilling [ 35 ], electrochemical discharge [ 36 , 37 ], and mechanical drilling [ 38 ]. Most of these methods, however, are risky, difficult, and inefficient to use for the fabrication of a large number of micro-through-holes on a single glass slide.…”
Section: Introductionmentioning
confidence: 99%