Appropriate chip-to-tube interfacing is an enabling technology for high-pressure and high-speed liquid chromatography on chip. For this purpose, various approaches, to connect pressure resistant glass chips with HPLC pumps working at pressures of up to 500 bar, were examined. Three side-port and one top-port connection approach were evaluated with regard to pressure stability and extra column band broadening. A clamp-based top-port approach enabled chip-HPLC-MS analysis of herbicides at the highest pressure and speed.

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Laser-microstructured double-sided biocompatible adhesive tapes as intermediated bonding layers are potential candidates for hybrid integration of a disposable biochip. In the EU-PHOCNOSIS project, such thin adhesive tapes are proposed to integrate the polymer microfluidic system with the optical sensor chip. Three laser-assisted structuring methods are investigated to efficiently transfer microchannel patterns to the adhesive tape at room temperature. The test structure design consists of a single channel with 400 µm wide, 30 mm length and two circular receivers with 2 mm radius. The best structuring results are found by using a UV picosecond laser.

Glass as a substrate material for interposer application has many benefits compared to conventional packaging materials like silicon, ceramic or polymer based laminates because of its excellent dielectric and transparent properties. Furthermore, the integration potential of glass is superior because of the dimensional stability under thermal load and the coefficient of thermal expansion (CTE) matching to that of silicon ICs. A small pitch size of conductor traces, small scale through-vias and high alignment accuracy are the key requirements that will be achieved from glass based packaging. Also the transparency of glass has benefits for photonic packaging. Glass substrates are available in wafer and large scale panel formats.Very fast CO 2 -laser drilling of holes and thermal posttreatments for reducing mechanical stress are very promising for fast processing and high reliability. Holes with a diameter smaller 100 µm in different glasses with thicknesses between 145 and 500 µm have been achieved by CO 2 -laser drilling. The holes have been metallized by sputtering a seed layer and galvanic copper platting. The CO 2 -laser drilling in combination with copper metallization has high potential for through glass via forming in glass substrates for interposer applications.

Due to high bandwidth potential, optical single-mode signal transmission is superior to electrical as well as optical multimode signal transmission. For years, optical single-mode fiber cables have been used in telecommunication networks. However, there is a lack of photonic system integration based on optical single-mode interconnects in printed circuit boards and modules for signal transmission between electro-optical components and optical fibers. Therefore, a thin glass-based photonic integration concept for single-mode signal transmission was developed. Optical waveguides and optical free space interconnects are integrated in a single or a stack of thin glass sheets for module and printed circuit board packaging. For light routing inside a thin glass sheet, a singlemode waveguide technology on wafer level (150 mm) was developed promising for scaling up on panel size (45 × 60 cm2). The waveguides show single-mode behavior, low propagation (0.05 dB/cm) and fiber coupling (- 0.3 dB) losses at wavelength of 1550 nm. Different waveguide structures such as 180°-bends, S-bends, splitters and crosses have been integrated in thin glass and characterized in detail. Coupling mechanism and misalignment loss has also been studied. Technologies for fiber laser joining on glass as well as laser structuring of an optical mirror are introduced and first results are presented. Generic module and board-based photonic packaging solutions can be put into practice by applying all introduced technologies and will be demonstrated for a chip-to-fiber module package platform