Advances in thick and thin film analysis using interferometry

Retaining rings made of poly͑phenylene sulfide͒ ͑PPS͒ and polyetheretherketone ͑PEEK͒ with two different slot designs were subjected to a 4 h wear test. During the chemical mechanical planarization ͑CMP͒ process, the PPS retaining ring induced a higher coefficient of friction ͑COF͒ by ϳ0.1 than the PEEK retaining rings. In addition, the PPS retaining ring exhibited a higher wear rate than the PEEK retaining rings by ϳ28%. Although the retaining ring slot design did not significantly affect the COF and wear rate, retaining rings with sharp slot edges resulted in higher pad surface abruptness.During chemical mechanical planarization ͑CMP͒ processes, retaining rings are used to secure wafers from slipping out of the wafer carrier head. For a typical polishing platform, such as Applied Materials Mirra and Reflexion polishers, the retaining ring is pressed against the pad surface at a pressure normally higher than the wafer polishing pressure. As a result, frictional force is generated among the retaining ring, slurry, and pad surface, leading to an increase in the pad temperature, which in turn impacts material removal rate and nonuniformity. In recent years, advanced engineering plastics have become materials of choice for constructing retaining rings because they can be easily modified to withstand various chemicals in CMP slurries while maintaining dimensional stability over a wide range of temperatures and pressures and extending the service life of retaining rings. Furthermore, compared with metal and ceramics, advanced engineering plastics can be formulated to have a very low level of ionic impurities and inorganic element contamination.There are several patents and publications associated with retaining rings and their applications. For example, Chen and Zuniga and Chen et al. showed new retaining ring slot designs in 2005. 1,2 Zuniga et al. invented a multilayer retaining ring and Wang and Zuniga improved the design afterward. 3,4 Chen et al. invented a specific retaining ring consisting of two different parts. 5 Hoffman compared the thermal, chemical, and mechanical properties of several commercially advanced machinable plastics. 6 In that study, the wear results were simulated without any experimental confirmation. Moussa and Quartapella and Gitis et al. performed wear tests on three materials commonly used for CMP retaining rings ͓poly͑phe-nylene sulfide͒ ͑PPS͒, polyetheretherketone ͑PEEK͒, and polycarbonate͔ and reported coefficient of friction ͑COF͒ and wear rates. 7,8 However, the wear tests were conducted using a small piece of substrate that was substantially different in size and design compared to the actual retaining rings used in the semiconductor industry.In this study, three retaining rings designed for 200 mm wafer polishing were subjected to a 4 h wear test. The retaining rings were made of two different materials ͑PPS and PEEK͒ with two different slot designs. Frictional force generated among the retaining ring, slurry, and pad surface was measured in real-time during the wear test. Pad surfa...

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“…White light interferometry was used to accurately measure surface topography and step height. [12][13][14] In …”

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confidence: 99%

Tribological, Thermal, and Wear Characteristics of Poly(phenylene sulfide) and Polyetheretherketone Retaining Rings in Interlayer Dielectric CMP

Wei¹,

Zhuang²,

Sampurno³

et al. 2010

Electrochem. Solid-State Lett.

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“…9 Similar information is can obtain and by the study superficial layers by diffraction with electrons. [12][13][14][15] By this method is can research a thickness of 10 -…”

Section: Researching Methods For the Thin Superficial Layersmentioning

confidence: 99%

Study of Superficial Layers Obtained by Selective Transfer in the Friction Couples

Ilie¹

2017

IPCSE

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“…Research into the degradation of bulk polymers has a longer history and is more comprehensive, and many quality reviews have already been written in this area. 23,84,86,87,[89][90][91] This paper focuses on films and effort has been taken to concentrate on pertinent degradation mechanisms found specifically in these systems rather than discussing all possible mechanisms in a generic fashion. It will be noted that liquid interactions are not included.…”

Section: Content Of Papermentioning

confidence: 99%

Degradation of polymer films

Cheneler

Bowen

2013

Soft Matter

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In this review paper the current state of research into the physical degradation of polymer films is elucidated. Modern applications of polymer films and the implication of their degradation are discussed. Recent investigations into solid interactions such as abrasion, adhesion, fatigue and other failure modes as well as plasma and photonic interactions are examined. This investigation highlights key degradation mechanisms as well as areas where controversy over these mechanisms lies, and suggests directions for future research.

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Advances in thick and thin film analysis using interferometry

Cited by 20 publications

References 11 publications

Tribological, Thermal, and Wear Characteristics of Poly(phenylene sulfide) and Polyetheretherketone Retaining Rings in Interlayer Dielectric CMP

Tribological, Thermal, and Wear Characteristics of Poly(phenylene sulfide) and Polyetheretherketone Retaining Rings in Interlayer Dielectric CMP

Study of Superficial Layers Obtained by Selective Transfer in the Friction Couples

Degradation of polymer films

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