2013
DOI: 10.1016/j.snb.2012.04.003
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Airborne engineered nanoparticle mass sensor based on a silicon resonant cantilever

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Cited by 145 publications
(88 citation statements)
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“…Real NPs can be detected using mass detectors based on micro/nanoelectromechanical systems (M/NEMS) which in addition offer the necessary potential of miniaturization and cost-effective batch fabrication. Indeed, most of the currently introduced M/NEMS-based NP mass detectors still need to be operated at high flow velocity using a pump and characterized with external bulky, heavy, and vacuum tools [10][11][12][13][14][15][16]. In contrast, our second generation of a fully integrated cantilever-based airborne NP detector (CANTOR-2) developed in this work has small size and low weight.…”
Section: Introductionmentioning
confidence: 99%
“…Real NPs can be detected using mass detectors based on micro/nanoelectromechanical systems (M/NEMS) which in addition offer the necessary potential of miniaturization and cost-effective batch fabrication. Indeed, most of the currently introduced M/NEMS-based NP mass detectors still need to be operated at high flow velocity using a pump and characterized with external bulky, heavy, and vacuum tools [10][11][12][13][14][15][16]. In contrast, our second generation of a fully integrated cantilever-based airborne NP detector (CANTOR-2) developed in this work has small size and low weight.…”
Section: Introductionmentioning
confidence: 99%
“…In Eq. (3) M H 2 O and H 2 O are the molecular mass (18 g/mol) and density (1 g/cm 3 ), respectively, of water, N A is Avogadro's number (6.0 × 10 23 mol −1 ), and A MC is the MC surface area [26]. The MC used in the present work had a total surface area of 3.6 × 10 −4 cm 2 , implying a monolayer of water film on both sides of MC will weigh ∼11 pg.…”
Section: Resultsmentioning
confidence: 99%
“…4b). In contract to the WB of design 2, which was prepared by using of implanted piezoresistors, WB structures of design 1 were anisotropically created using ICP DRIE process utilizing O 2 and SF 6 as etch gases at a cryogenic temperature (Sentech Instruments GmbH, Germany; Wasisto et al, 2012Wasisto et al, , 2013Wasisto et al, , 2014. In this case, an etching parameter set of an ICP power of 500 W, a high-frequency power of 6 W, an O 2 flux of 7 sccm (sccm is standard cubic centimeter per minute) and an SF 6 flux of 129 sccm at −80 • C was utilized (Fig.…”
Section: Micro-fabricationmentioning
confidence: 99%