2009
DOI: 10.1016/j.diamond.2009.02.018
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AlGaN/GaN MISHEMT with hBN as gate dielectric

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Cited by 37 publications
(24 citation statements)
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“…The presence of slow traps can be associated with the VO h-BN/GaN interface. The Dit for the slow traps related to the BN/GaN interface is comparable to the h-BN/GaN interface trap density reported elsewhere (~2×10 12 cm -2 eV -1 at EC-ET of 0.4 eV) using the PLS technique[101] on MW-PECVD deposited h-BN[91].…”
supporting
confidence: 84%
See 1 more Smart Citation
“…The presence of slow traps can be associated with the VO h-BN/GaN interface. The Dit for the slow traps related to the BN/GaN interface is comparable to the h-BN/GaN interface trap density reported elsewhere (~2×10 12 cm -2 eV -1 at EC-ET of 0.4 eV) using the PLS technique[101] on MW-PECVD deposited h-BN[91].…”
supporting
confidence: 84%
“…For example, in switching applications it is important to investigate the interface traps as they could degrade device switching properties through charging and discharging [90]. Although researchers have realized MISHEMTs with h-BN, [91]- [93] no interface properties have so far been reported for VO h-BN on AlGaN/GaN heterostructures.…”
Section: Gan Mishemt Using H-bn 41 Introductionmentioning
confidence: 99%
“… 8 Pairing h-BN with GaN resulted in the development of, inter alia, light emitting diodes (LEDs), 9 11 UV photodetectors, 12 , 13 and metal–insulator–semiconductor high-electron mobility transistors (MISHEMTs). 14 In the case of GaN-based light emitters, h-BN provides electron blocking and more efficient hole injection into the active region. For transistor structures, h-BN acts as a passivation layer and gate dielectric, neutralizing the surface traps and reducing the leakage current.…”
Section: Introductionmentioning
confidence: 99%
“…As a gateinsulator of the MIS devices, high-dielectric-constant (high-k) oxide materials, such as Al 2 O 3 , 1 HfO 2 , 2,3 and also high-k nitride materials, such as AlN, 4-8 BN, 9,10 have been investigated. Owing to their high thermal conductivities, the nitride materials are favorable also for passivation of GaN-based devices, exhibiting good heat release properties.…”
Section: Introductionmentioning
confidence: 99%