Alignment tolerant, low voltage, 023 Vcm, push-pull silicon photonic switches based on a vertical pn junction

Zanzi, Andrea; Vagionas, Christos; Griol, Amadeu; Rosa, Agostinho C.; Lechago, Sergio; Moralis-Pegios, Miltiadis; Vyrsokinos, K.; Pleros, Nikos; Kraft, Jochen; Sidorov, V.; Sirbu, Bogdan; Tekin, Tolga; Sanchís, Pablo; Brimont, A.

doi:10.1364/oe.27.032409

Cited by 11 publications

(7 citation statements)

References 34 publications

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“…A slot was etched in the center of the disc, with dimensions about 2 µm × 0.3 µm to suppress higher-order modes. A vertical p-n junction was used for the microdisc, which improves the modulation efficiency [31], [32] and the fabrication tolerance [33]. To reduce dopant-induced optical loss, only about one-half of the perimeter was doped with p (BF 2 , 4×10 13 cm −2 , 380 keV) and n (As, 4×10 13 cm −2 , 70 keV) dopants, and the regions of the disc near the waveguides were left undoped [34].…”

Section: Methodsmentioning

confidence: 99%

Voltage-Controlled Fast and Low-Loss Single-Photon Cross-Bar Switch Using Integrated Photonics

Wang

Mookherjea

2023

J. Lightwave Technol.

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A high-speed, low-loss modular cross-bar switching element suitable for single photons is demonstrated. Entanglement preserving voltage-driven switching of single photons is achieved with a unique combination of ultra-fast and low-loss characteristics (less than 50 ps 10%-90% transition time and greater than 90% transmission), and we present a roadmap towards even lower losses. The switch properties are well matched to the wavelength, bandwidth and lifetime of photons generated by spontaneous four-wave mixing sources also realized in silicon photonics. Such a switch can enable reconfigurability of each single photon and addressing of each time bin, and benefit future quantum photonic circuits.

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Section: Methodsmentioning

confidence: 99%

Voltage-Controlled Fast and Low-Loss Single-Photon Cross-Bar Switch Using Integrated Photonics

Wang

Mookherjea

2023

J. Lightwave Technol.

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“…Although the optical switches using the carrier injection with a pin junction [93,94] is the main principle to achieve large phase modulation, its speed and power consumption suffer owing to the minority carrier response in Si compared to the modulators mainly using a pn junction [42]. The feasibility of the optical switches using a p-n junction is reported to achieve high-speed operation and low power consumption [95]. However, due to large carrier-induced loss for phase modulation, the crosstalk of Si pn and pin structures is worse compared to other structures [45][46][47][48].…”

Section: Optical Switchesmentioning

confidence: 99%

Heterogeneously-Integrated Optical Phase Shifters for Next-Generation Modulators and Switches on a Silicon Photonics Platform: A Review

et al. 2021

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The realization of a silicon optical phase shifter marked a cornerstone for the development of silicon photonics, and it is expected that optical interconnects based on the technology relax the explosive datacom growth in data centers. High-performance silicon optical modulators and switches, integrated into a chip, play a very important role in optical transceivers, encoding electrical signals onto the light at high speed and routing the optical signals, respectively. The development of the devices is continuously required to meet the ever-increasing data traffic at higher performance and lower cost. Therefore, heterogeneous integration is one of the highly promising approaches, expected to enable high modulation efficiency, low loss, low power consumption, small device footprint, etc. Therefore, we review heterogeneously integrated optical modulators and switches for the next-generation silicon photonic platform.

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“…For these reasons, the active modulator region is a vertical pn junction (Figure 15) that produces a larger effective index change than horizontal (lateral) ones [40]. In addition to their versatility, vertical designs are less sensitive to fabrication variations than conventional ones [41]. L3MATRIX modulators also benefit from the high tolerance to mask alignment inaccuracies because their fabrication depends on the implantation energy rather than lithography resolution.…”

Section: Conventional Modulatorsmentioning

confidence: 99%

Co-Package Technology Platform for Low-Power and Low-Cost Data Centers

Papatryfonos

Selviah

Maman³

et al. 2021

Applied Sciences

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We report recent advances in photonic–electronic integration developed in the European research project L3MATRIX. The aim of the project was to demonstrate the basic building blocks of a co-packaged optical system. Two-dimensional silicon photonics arrays with 64 modulators were fabricated. Novel modulation schemes based on slow light modulation were developed to assist in achieving an efficient performance of the module. Integration of DFB laser sources within each cell in the matrix was demonstrated as well using wafer bonding between the InP and SOI wafers. Improved semiconductor quantum dot MBE growth, characterization and gain stack designs were developed. Packaging of these 2D photonic arrays in a chiplet configuration was demonstrated using a vertical integration approach in which the optical interconnect matrix was flip-chip assembled on top of a CMOS mimic chip with 2D vertical fiber coupling. The optical chiplet was further assembled on a substrate to facilitate integration with the multi-chip module of the co-packaged system with a switch surrounded by several such optical chiplets. We summarize the features of the L3MATRIX co-package technology platform and its holistic toolbox of technologies to address the next generation of computing challenges.

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Alignment tolerant, low voltage, 023 Vcm, push-pull silicon photonic switches based on a vertical pn junction

Cited by 11 publications

References 34 publications

Voltage-Controlled Fast and Low-Loss Single-Photon Cross-Bar Switch Using Integrated Photonics

Voltage-Controlled Fast and Low-Loss Single-Photon Cross-Bar Switch Using Integrated Photonics

Heterogeneously-Integrated Optical Phase Shifters for Next-Generation Modulators and Switches on a Silicon Photonics Platform: A Review

Co-Package Technology Platform for Low-Power and Low-Cost Data Centers

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