All laser-based fabrication of microchannel heat sink

Zhou, Haoyu; Lee, Jungbae; Kang, Min-Soo; Kim, Hakgae; Lee, Hyoungsoon; In, Junyong

doi:10.1016/j.matdes.2022.110968

Cited by 15 publications

(3 citation statements)

References 44 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Recent studies on the laser process of PI and PDMS, which are common substrates for flexible/stretchable electronics and healthcare devices, further confirm that high-quality micromachining [ 7 , 125 ] as well as adhesive-free bonding [ 126 ] between these two substrates are realizable through the laser-induced photothermal reaction. These developmental aspects suggest that laser processes can be among the core fabrication technique for emerging applications, heading towards all-laser fabrication of a device [ 127 , 128 ] up to a system level. We also expect that the laser process will become more valuable as the global semiconductor shortage continues.…”

Section: Conclusion and Perspectivementioning

confidence: 99%

Direct Writing of Functional Layer by Selective Laser Sintering of Nanoparticles for Emerging Applications: A Review

et al. 2022

View full text Add to dashboard Cite

Selective laser sintering of nanoparticles enables the direct and rapid formation of a functional layer even on heat-sensitive flexible and stretchable substrates, and is rising as a pioneering fabrication technology for future-oriented applications. To date, laser sintering has been successfully applied to various target nanomaterials including a wide range of metal and metal-oxide nanoparticles, and extensive investigation of relevant experimental schemes have not only reduced the minimum feature size but also have further expanded the scalability of the process. In the beginning, the selective laser sintering process was regarded as an alternative method to conventional manufacturing processes, but recent studies have shown that the unique characteristics of the laser-sintered layer may improve device performance or even enable novel functionalities which were not achievable using conventional fabrication techniques. In this regard, we summarize the current developmental status of the selective laser sintering technique for nanoparticles, affording special attention to recent emerging applications that adopt the laser sintering scheme.

show abstract

Section: Conclusion and Perspectivementioning

confidence: 99%

Direct Writing of Functional Layer by Selective Laser Sintering of Nanoparticles for Emerging Applications: A Review

et al. 2022

View full text Add to dashboard Cite

show abstract

“…However, conventional machining has many challenges to manufacturing the microchannels such as lack of accuracy and precision, thermal damage is caused during machining, tool wear can affect the process productivity and chemicals can be hazardous to be used in the manufacturing environment. Laser machining process is a non-contact, chemical-free machining process capable of manufacturing microchannels on different types of materials like metals, polymers, and ceramics [8]. But this process also can form defects such as cracks and bends caused due to heat-affected zones [9].…”

Section: Introductionmentioning

confidence: 99%

Ultrafast Laser Fabrication of Microchannels on Aluminium Alloy Substrate

Cholkar,

Chatterjee,

Kinahan

et al. 2023

SSP

View full text Add to dashboard Cite

Aluminium alloy 6061 has a versatile application within industrial heat exchangers, heat sinks, chemical equipment, and frames of aircraft and ships. Its physical and mechanical properties such as lightweight, high strength, corrosion resistance, and thermal and electrical conductivity make it a suitable material choice for these applications. Within thermal and micro-electromechanical applications, such as heat exchanges, radiators, and heat sinks used in microelectronics, the dissipation of heat plays an important role. For optimum heat dissipation, a higher surface area is required. This can be achieved by modifying the surface by fabricating microchannels. A number of processing techniques are used for fabricating microchannels on different materials. A laser is a flexible non-contact machining tool that may be used to create any profile or contour on practically any material. In recent times due to the advancement in laser technology, the use of ultrafast laser material processing is one potential route toward further extending the fabrication of high-quality microchannels without defects caused due to heat-affected zones and in a sustainable manner. In this paper, we present an experimental work of fabrication of microchannels on an aluminium alloy 6061 surfaces by using a low power (<4 W) 400 fs laser system. The dimensional accuracy of the fabricated microchannels is assessed using scanning electron microscopy and 3D profilometry. Furthermore, as processing speed and scale is of importance in industrial laser processes, the use of scanning optics is examined as a means of developing a rapid and scalable ultrafast laser process.

show abstract

“…Joints of dissimilar materials give different combinations of mechanical and metallurgical characteristics in a product. Thus, bimetallic joints [ 12 , 13 , 14 , 15 , 16 , 17 ] are necessary, especially in a vacuum [ 18 , 19 , 20 , 21 , 22 , 23 ] and cryogenic systems [ 24 , 25 , 26 , 27 ]. Because of the unique combination of distinct properties, copper/stainless-steel bimetals are in great demand [ 28 , 29 , 30 , 31 , 32 , 33 , 34 ].…”

Section: Introduction—joining Of Copper To Stainless Steel Bimetallic...mentioning

confidence: 99%

The Joining of Copper to Stainless Steel by Solid-State Welding Processes: A Review

et al. 2022

View full text Add to dashboard Cite

Joining immiscible materials such as copper and stainless steel together is a significant concern due to distinct mechanical and metallurgical properties across the joint line, such as melting points, the coefficient of linear thermal expansion, and thermal conductivity. The joint properties of copper to stainless steel welds are in great demand for various mechanical components of the international thermonuclear experimental reactor, ultra-high vacuum system, plan wave linear-accelerator or linac structure, and heat exchanger. These dissimilar-metals joints offer excellent flexibility in design and production, leading to a robust structure for many cutting-edge applications. Hence, the present article reviews the copper to stainless steel joining mechanism under different solid-state processing conditions. The present understanding says that defect-free strong joints between the dissimilar metals are systematically possible. Apart from this understanding, the authors have identified and highlighted the gaps in the research exploration to date. Moreover, a sustainable methodology to achieve a desirable weld of copper to stainless steel depends on favorable processing conditions.

show abstract

All laser-based fabrication of microchannel heat sink

Cited by 15 publications

References 44 publications

Direct Writing of Functional Layer by Selective Laser Sintering of Nanoparticles for Emerging Applications: A Review

Direct Writing of Functional Layer by Selective Laser Sintering of Nanoparticles for Emerging Applications: A Review

Ultrafast Laser Fabrication of Microchannels on Aluminium Alloy Substrate

The Joining of Copper to Stainless Steel by Solid-State Welding Processes: A Review

Contact Info

Product

Resources

About