“…Typically, alloying with another metal (i.e. NiMo, 268,269 NiCu, 270 CoNiMo, 271 NiWCu 272 ), doping with a non-metal element (i.e. N, B), 273,274 strain engineering 275 and interfacial construction 276 have been validated to be available attempts for modulating the electronic structure of Ni and optimizing the binding interactions with surface intermediates.…”