An environmental comparison of packaging and interconnection technologies

Abstract

Packaging and interconnection are driving forces behind the miniaturization of electronics. Since miniaturization means less use of resources this trend seems inherently environmentally benign. Adverse effects may overlay this simple truth. The investments for new production facilities rise, the complexity and closeness of non-separable compounds in electronic products increase and the amount and applications of electronic goods multiply. The goal must be to influence new technology developments as early as possible to ensure that the balance of the listed effects remains positive for the environment. As a first step in this direction a simple comparison of different interconnection options is made which is based on the material content of the different printed circuit board assemblies

Comparative alternative materials assessment to screen toxicity hazards in the life cycle of CIGS thin film photovoltaics

“…Within the three hazard groups there is a relative prioritization of hazard metrics similar to GS, where certain metrics yield higher TPI values. The three hazard group scores are weighted equally, combined, and scaled into a 0-100 value (0 = no hazard, 100 = very hazardous) [18,19]. For example, ethylene has very high HH impacts but minimal W-E and OH impacts, with resultant TPI = 35.…”

“…Two hazard assessment tools are used to score and rank materials in this study: The Green Screen for Safer Chemicals TM (GS) and the Toxic Potential Indicator (TPI) developed by Clean Production Action (CPA) and Fraunhofer IZM, respectively [17][18][19]. After completing both CAAs, we use the LCHP methodology to establish a combined, low-hazard option for both manufacturing process chemicals and solar cell material composition simultaneously.…”

Life-Cycle Assessment of Semiconductors

“…For example, Paul Blowers measured LCI data for supercritical CO 2 as a replacement for ultra-pure water [12]. There has been a particular focus on solder and packaging technologies, due to the exceptional hazard of lead, a potent neurotoxin, in solder [63,5,25,36].…”

Método de desmontagem de placas de circuito impresso provenientes de resíduos de equipamentos eletroeletrônicos para reciclagem

“…As substâncias perigosas estão dispersas em diversos componentes que constituem a PCI. Os consequentes danos causados ao meio ambiente e à saúde humana ao longo de todo o ciclo de vida do EEE se tornaram objeto de vários estudos, notadamente os associados ao fim de vida (MOHITE;ZHANG, 2005;NISSEN et al, 1998;SEPULVEDA et al, 2010;ZHENG et al, 2008;MENAD;BJORKMAN;ALLAIN, 1998;WILLIAMS et al, 2008). Os REEE's, porém, não podem ser encarados somente como um lixo perigoso.…”

“…A integração dos circuitos como consequencia da miniaturização associada à novos modelos de encapsulamento, novas aplicações e à necessidade de transmissão de maior volume de dados e com velocidades maiores contribuem para a divergência no espectro de composição das PCI's. Quanto maiores forem as diferenças de idade, origem e tecnologia de um mesmo REEE, maiores serão as diferenças de composição (NISSEN et al, 1998;ZHANG, 2008).…”