An Integrated Thermal Compensation System for MEMS  Inertial Sensors

Chiu, Sheng-Ren; Teng, Li-Tao; Chao, Jen-Wei; Sue, Chung-Yang; Lin, Chih-Hsiou; Chen, Hong-Ren; Su, Yan–Kuin

doi:10.3390/s140304290

Cited by 17 publications

(10 citation statements)

References 16 publications

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“…Therefore, the SE is employed to calculate the sequence The signal of gyro is decomposed by IPSO-VMD, IPSO is employed to get the optimal VMD parameters k and α. First, initialize the parameters of IPSO: the range of variable k is [2,12], the range of variable α is [10000,20000], the population of particles is 50, the maximum number of iterations is 30, and the inertia weight is 0.8, the learning factor one and two are all 1, check whether the optimal individual becomes better every eight cycles and particle replacement probability is 0.5. PE is used as the fitness function.…”

Section: Experiments Results and Analysismentioning

confidence: 99%

“…Cao et al [11] proposed how the mechanical model of the gyroscope is affected by temperature changes, and the method of improving the silicon structure is used to achieve hardware compensation. In [12], an effective gyro thermal compensation system is proposed by Chiu et al for low temperature bias drift (TBD) MEMS. In order to compensate for the drift temperature energy loss, Liu et al adopted a more complete design structure for MEMS vibratory gyroscopes [13].…”

Section: Introductionmentioning

confidence: 99%

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A Temperature Error Parallel Processing Model for MEMS Gyroscope based on a Novel Fusion Algorithm

Cao

Shen

2020

Electronics

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To deal with the influence of temperature drift for a Micro-Electro-Mechanical System (MEMS) gyroscope, this paper proposes a new temperature error parallel processing method based on a novel fusion algorithm. Firstly, immune based particle swarm optimization (IPSO) is employed for optimal parameters search for Variational Modal Decomposition (VMD). Then, we can get the optimal decomposition parameters, wherein permutation entropy (PE) is employed as the fitness function of the particles. Then, the improved VMD is performed on the output signal of the gyro to obtain intrinsic mode functions (IMFs). After judging by sample entropy (SE), the IMFs are divided into three categories: noise term, mixed term and feature term, which are processed differently. Filter the mixed term and compensate the feature term at the same time. Finally, reconstruct them and get the result. Compared with other optimization algorithms, IPSO has a stronger global search ability and faster convergence speed. After Back propagation neural network (BP) is enhanced by Adaptive boosting (Adaboost), it becomes a strong learner and a better model, which can approach the real value with higher precision. The experimental result shows that the novel parallel method proposed in this paper can effectively solve the problem of temperature errors.Electronics 2020, 9, 499 2 of 21 circuit design structure to reduce the damping coefficient, which is convenient and economical [15]. Yang et al. adopted a new concept whereby the on-chip temperature compensation of the MEMS gyroscope is realized by the on-chip sensor. In order to make the on-chip temperature of the micro gyroscope well controlled, the newly integrated serpentine micro heater is used to achieve this function [16]. Cui et al. analyzed the working principle of the gyroscope and adopted the vibration compensation of the drive mode, which has a good effect [17]. However, the hardware compensation cost is high and it is too difficult to implement.The second is through software compensation, it includes the removal of noise and temperature compensation. The software compensation method mainly establishes a model for the drift part and the noise part of the MEMS gyroscope to remove noise and compensate drift. For the establishment of the temperature drift model, the reference temperature and the corresponding temperature drift output obtained in advance are used as a set of training set data. The model is established after the learning and training of the algorithm. When the temperature value is input, the model can predict the output value as compensation. There are two main methods. The first one is serial processing, which first uses a filter to perform noise reduction on the signal and then uses a model to eliminate drift. The other one is parallel processing, which refers to extracting and processing noise components and drift components separately. Dominik uses a combination of experiments and numerical values to provide accurate ceramic acceleration at higher temperature [18]. Yang uses a sim...

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Section: Experiments Results and Analysismentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

A Temperature Error Parallel Processing Model for MEMS Gyroscope based on a Novel Fusion Algorithm

Cao

Shen

2020

Electronics

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“…In 2014, Chiu et al (2014) proposed a silicon MEMS gyroscope based on silicon-glass bonding process. To compensate the temperature-bias-drift (TBD) of the microgyroscope, the block diagram of proposed MEMS-based gyroscope system is shown in Fig.…”

Section: Temperature Characteristicsmentioning

confidence: 99%

Research development of silicon MEMS gyroscopes: a review

et al. 2015

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“…The coefficients of viscous friction forces, the characteristics of materials and the linear dimensions of the structure are changed under the temperature influence, which leads to a change in the rigidity of the elastic suspensions (ES), and consequently, of the eigenfrequencies (Wyatt, 2001). A large number of publications aimed to determine methods to improve the temperature characteristics of MEMS inertial sensors, including electronic temperature compensation and thermostatic control (Chiu et al, 2014;Cao et al, 2013;Wang et al, 2012;Nesterenko et al, 2015).…”

Section: Introductionmentioning

confidence: 99%

Constructive approach to reduce the influence of temperature on spring suspension eigenfrequencies

Baranov

Nesterenko

Barbin

et al. 2020

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Purpose One of the problems encountered by developers of inertial systems, such as gyroscopes and accelerometers, is the critical dependence of the eigenfrequencies of elastic suspensions (ES) on temperature when using substrates for sensors made of dielectric materials, such as borosilicate glass. The internal stresses arising in the ES caused by the difference in the temperature coefficients of linear expansion (TCLE) lead to deformation of the sensor and complication of the electronic part of the sensor. The purpose of this paper is to approach for in-plane and out-of-plane ES are considered that allow for minimization of the influence of internal stresses on eigenfrequencies. Design/methodology/approach Analytical, finite element and experimental results are considered. The temperature coefficient of thermal expansion, the Young’s modulus and the Poisson ratio are given as a function of temperature. The shape of the spring elements (SEs) and the construction of the elastic suspension are the main topics of focus in this study. The authors’ out-of-plane ES based on a meander-like spring element implemented via finite element modeling show good agreement with the experimental results. Findings Meander-like SEs have been developed that have lower temperature errors in comparison with traditional types of SEs. The main contribution to the change in the eigenfrequency from temperature is made by internal stresses that arose from the deformation of the bonded materials with different TCLE. The change of eigenfrequency from the temperatures that were calculated by finite element method did not exceed 0.15%, however, in practice, the scatter of the obtained characteristics for different samples showed a change of up to 0.3%. Originality/value This study shows a way to design and optimize the structure and theoretical background for the development of the microelectromechanical systems (MEMS) inertial module combining the functions of gyroscope and accelerometer. The obtained results will improve and expand the manufacturing technology of MEMS gyroscopes and accelerometers.

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An Integrated Thermal Compensation System for MEMS Inertial Sensors

Cited by 17 publications

References 16 publications

A Temperature Error Parallel Processing Model for MEMS Gyroscope based on a Novel Fusion Algorithm

A Temperature Error Parallel Processing Model for MEMS Gyroscope based on a Novel Fusion Algorithm

Research development of silicon MEMS gyroscopes: a review

Constructive approach to reduce the influence of temperature on spring suspension eigenfrequencies

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