Electronics Packaging Forum 1991
DOI: 10.1007/978-94-009-0439-2_1
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An Introduction to Tape Automated Bonding Technology

John H. Lau1,
S. Erasmus2,
D. Rice3
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Cited by 3 publications
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References 67 publications
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Thermomechanics for Electronics Packaging

Lau1
1993
Thermal Stress and Strain in Microelectronics Packaging
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Thermomechanics for Electronics Packaging

Lau1
1993
Thermal Stress and Strain in Microelectronics Packaging
7
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3
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No‐clean and Solvent‐clean Mass Reflow Processes of 0.4 mm Pitch, 256‐Pin Fine Pitch Quad Flat Packs (QFPs)

Lau
1
,
Govila
2
,
Larner
3
et al. 1992
Circuit World
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No-clean And Water-clean Mass Reflow Processes Of 0.4 mm Pitch, 256-Pin Fine Pitch Quad Flat Packs (QFP)

Lau
1
,
Govila2,
Larner3
et al.
Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium
2
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