2003
DOI: 10.1109/jproc.2003.811705
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An overview of flash architectural developments

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Cited by 19 publications
(4 citation statements)
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“…Cells store data in floating gate transistors through electron tunneling, and all cells connected to a given word line comprise a page within a block. All cells in a page are operated on together and typically allow for 512 bytes + 16 spare bytes, 2048 bytes + 64 spare bytes, or 4096 bytes + 128 spare bytes of storage in the page [32]. A memory block often contains either 32 or 64 pages.…”
Section: D Nand Flashmentioning
confidence: 99%
“…Cells store data in floating gate transistors through electron tunneling, and all cells connected to a given word line comprise a page within a block. All cells in a page are operated on together and typically allow for 512 bytes + 16 spare bytes, 2048 bytes + 64 spare bytes, or 4096 bytes + 128 spare bytes of storage in the page [32]. A memory block often contains either 32 or 64 pages.…”
Section: D Nand Flashmentioning
confidence: 99%
“…Two internal Dickson charge pumps (CP) are used [1]: -3.7 V and + 6.8 V to generate high voltages in the memory system for operating the cell. The schematic illustration of the CP circuit is shown in Fig.…”
Section: Device and Experimeantalmentioning
confidence: 99%
“…HV circuits are essential in flash memories to provide high voltages for program and erase operation [1], and are one of the most sensitive building blocks under radiation, leading to write failure after exposure to 20-60 krad(Si) [2]. For radiation hardened flash memories design, it is necessary to understand the origin of the HV circuits' degradation: whether the charge pumps or/and the HV management circuits are degraded.…”
Section: Introductionmentioning
confidence: 99%
“…This stands in contrast to conventional memory devices or E‐fuses, which typically rely on programming pads or dedicated digital engines. [ 30 , 31 ] The proposed fuse/anti‐fuse method does have the drawback of not enabling real‐time chip programming during active operation and necessitates a relatively slower, serialized post‐fabrication process while methods such as programming through wireless downlink communication can offer quicker alternatives. (We note that there are number of companies developing next generations of laser‐ion‐beam process tools for chip post‐process editing).…”
Section: Introductionmentioning
confidence: 99%