An overview of Pb-free, flip-chip wafer-bumping technologies

Kang, Sung K.; Gruber, P.; Shih, Da‐Yuan

doi:10.1007/s11837-008-0075-2

Cited by 18 publications

(4 citation statements)

References 15 publications

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“…Controlling the undercooling of Sn-rich solders is an important issue in such a new waferbumping process, C4NP (C4 new process), where melting/solidification of multiple solder bumps in a small volume is a key metallurgical process involved [33,39]. In C4NP, a molten solder is filled into a glass mold containing prefabricated cavities of I/O footprint of a silicon wafer, and then solder bumps are transferred from the glass mold to the wafer by aligning/ melting the solidified bumps.…”

Section: Controlling the Undercooling Of Sn Solidificationmentioning

confidence: 99%

‘Effects of Minor Alloying Additions on the Properties and Reliability of Pb‐Free Solders and Joints’

Kang¹

2012

Lead‐Free Solders: Materials Reliability for Electronics

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Since July, 2006, following the EUs RoHS legislation, the consumer electronics industry has been offering 'green' products by eliminating Pb-containing solders and other toxic materials. This transition has been relatively smooth, because the reliability requirements are less stringent. However, the Pb-free transition for high-performance electronic systems (such as servers and telecommunication) is still on-going due to their rigorous reliability requirements. For example, the research and development efforts to implement Pb-free flipchip interconnections for high-end applications are still very active.In this chapter, the recent progress in Pb-free solder development, especially minor alloy additions to Sn-rich solders is reviewed in light of improving various physical, mechanical, metallurgical or electrical properties of solder joints. The topics to be discussed include those such as control of undercooling, microstructure, interfacial reactions, or void formation, as well as enhancing impact resistance, electromigration, and other mechanical properties.

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Section: Controlling the Undercooling Of Sn Solidificationmentioning

confidence: 99%

‘Effects of Minor Alloying Additions on the Properties and Reliability of Pb‐Free Solders and Joints’

Kang¹

2012

Lead‐Free Solders: Materials Reliability for Electronics

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“…Typical fields of application are sacrificial layers during surface MEMS patterning, masking layers during plasma etch processes or as a protection layer during electroplating of solder bumps [1]. Although the use of thick resists is very common, their successful integration often depends on the ability to remove the resist after certain processing steps.…”

Section: Introductionmentioning

confidence: 99%

Introduction of an innovative water based photoresist stripping process using intelligent fluids

Rudolph

Thrun

Schümann³

et al. 2014

SPIE Proceedings

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The usage of phasefluid based stripping agents to remove photoresists from silicon substrates was studied. Due to their highly dynamic inner structure phasefluids offer a new working principle, they are penetrating layers through smallest openings and lift off the material from the surface. These non-aggressive stripping fluids were investigated regarding their cleaning efficiency as well as contamination behavior to enable usage in semiconductor and MEMS manufacturing. A general proof of concept for the usage of phasefluids in resist stripping processes is shown on silicon coupons and BKM’s are given for different resist types. In addition a baseline process on 12inch wafers has been developed and characterized in terms of metallic and ionic impurities and defect level

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“…Packages with area-array solder bumps such as ball grid array (BGA) and flip chip (FC) are attracting great interest due to their good capabilities to provide a large number of I/Os [1,2]. While, with trends towards integration and miniaturization of electronic products, the sizes of the bumps have been reduced significantly, leading to high current density, serious Joule heating and high temperature in solder bumps [3][4][5].…”

Section: Introductionmentioning

confidence: 99%

Effect of Bump Shape on Current Density and Temperature Distributions in Solder Bump Joints under Electromigration

Zhao

Liu

et al. 2012

AMR

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Three dimensional thermo-electrical finite element analysis was employed to simulate the current density and temperature distributions for solder bump joints with different bump shapes. Mean-time-to-failure (MTTF) of electromigration was discussed. It was found that as the bump volume increased from hourglass bump to barrel bump, the maximum current density increased but the maximum temperature decreased. Hourglass bump with waist radius of 240 μm has the longest MTTF.

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An overview of Pb-free, flip-chip wafer-bumping technologies

Cited by 18 publications

References 15 publications

‘Effects of Minor Alloying Additions on the Properties and Reliability of Pb‐Free Solders and Joints’

‘Effects of Minor Alloying Additions on the Properties and Reliability of Pb‐Free Solders and Joints’

Introduction of an innovative water based photoresist stripping process using intelligent fluids

Effect of Bump Shape on Current Density and Temperature Distributions in Solder Bump Joints under Electromigration

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