2016
DOI: 10.1049/el.2015.3797
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Analogue/RF performance attributes of underlap tunnel field effect transistor for low power applications

Abstract: Tunnel field effect transistor (TFET) is being considered as an alternative to the conventional MOSFETs for low power system on chip applications. In this Letter, gate-drain underlap (UL) feature of double gate TFET for analogue/RF characteristic is discussed. Here, it is found that parasitic resistance induced by gate drain UL is not significant as compared with DG tunnel field effect transistor (DG-FET). Thus, the behaviour of RF figure of merit is different from DG-FET.

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Cited by 21 publications
(17 citation statements)
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“…TFET can be regarded as a promising alternative device of metal-oxide-semiconductors field effect transistor (MOSFET) to overcome the imperfection of short channel effects and betterment the characteristics of the device such as high ION/IOFF ratio, low OFF-current state lower subthreshold slope and minimize the power consumption [8]- [11]. The operating mechanism of TFET is based on the band-to-band tunneling phenomenon, while in MOSFET, the operating mechanism is based on the thermionic emission technique [12]- [14]. Besides all these advantages, but TFET is still suffering from some problems and facing challenges like low ON-current state, ambipolar behavior (conduction of current when the gate bias is negative), and higher parasitic capacitances [15]- [18].…”
Section: Introductionmentioning
confidence: 99%
“…TFET can be regarded as a promising alternative device of metal-oxide-semiconductors field effect transistor (MOSFET) to overcome the imperfection of short channel effects and betterment the characteristics of the device such as high ION/IOFF ratio, low OFF-current state lower subthreshold slope and minimize the power consumption [8]- [11]. The operating mechanism of TFET is based on the band-to-band tunneling phenomenon, while in MOSFET, the operating mechanism is based on the thermionic emission technique [12]- [14]. Besides all these advantages, but TFET is still suffering from some problems and facing challenges like low ON-current state, ambipolar behavior (conduction of current when the gate bias is negative), and higher parasitic capacitances [15]- [18].…”
Section: Introductionmentioning
confidence: 99%
“…The fabrication process of TFETs varies from that of Mosfets in terms of their source doping. Thus, the fabrication of NS-TFET is comparatively easier to implement with minimal deviation from the NS-FET fabrication process [19][20].…”
Section: Introductionmentioning
confidence: 99%
“…Here, ballistic movement in TFET represents flow of charge carriers in a well‐mannered path without mutual scattering between them. Therefore, it exhibits the extraordinary properties of high immunity to SCEs, low leakage (OFF state) current, and low subthreshold swing [2–6].…”
Section: Introductionmentioning
confidence: 99%