Analysis and optimization of parameters in optical polishing of large diameter BK7 flat components

Singh, Amandeep; Garg, Harshit; Kumar, Prabhat; Lall, Arun K.

doi:10.1080/10426914.2016.1221103

“…The flat surface polishing device ( 4) is placed on the surface to be polished (1). Compressed air passes through the inlet (2) into the stand.…”

Section: Methodsmentioning

confidence: 99%

“…There are only a few types of machine tools for polishing flat optical components. The most often used polishing process is chemical mechanical polishing, where a rotating workpiece is polished on a conventional eccentric single-arm spindle polisher with a polyurethane pad [1,2]. Parameters, such as polishing head speed, pressure, overarm speed [3], and polishing time need to be determined.…”

Section: Introductionmentioning

confidence: 99%

“…Process parameters such as the polishing head speed, pressure, overarm speed, slurry flow rate, polishing time, slurry temperature, abrasive concentration, abrasive size, and the parameters obtained after the polishing process (such as the MRR and surface roughness), were fully described. To optimise the polishing process, scientists test various parameter combinations using Taguchi's L9 orthogonal array for the design of experiments [1,3] and apply the in-process monitoring of the surface shape [6]. The process parameters were determined for a high-quality quartz glass substrate undergoing chemical mechanical polishing.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Investigation Into Levitating Polishing Disc Used for Flat Surface Finishing

Švagždytė

¹

,

Borodinas

²

,

Kilikevičius

³

et al. 2021

TFAMENA

0

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The paper presents a new type of flat surface polishing device. The polishing disc rotates using the pressure of compressed air. The polishing disc has a special geometry, wherein it has holes for flow turbulence minimisation in the air pressure areas of the boundary. The influence of the hole inclination angle on the rotational speed of the disk and the system efficiency was studied experimentally and numerically. It was established that the optimal inclination angle is a 20° angle that results in the maximum efficiency of the proposed system. In the experiment, three polishing discs with hole inclination angles of 0°, 20°, and 30° were studied; the discs were rotated using four air pressure values: 0.2, 0.3, 0.4, and 0.5 MPa. It was found that the optimal inclination angle of holes was 20° and that the fastest rotational speed, i.e. 1900 1/min, was reached at a maximum air pressure of 0.5 MPa.

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“…Orthogonal rotary regression test of factors and levels design and results were shown in Table 5 and Table 6. It was used the STATISTICA 8.0 to analyze the variance of the test results [20,21], and the regression equation was obtained by fitting the ternary quadratic polynomial. Pareto Chart of t-Values for Coefficients was shown in Fig.…”

Section: Fig 4 Influence Trend Of Single Factor On Mrrmentioning

confidence: 99%

Material removal rate of double-faced mechanical polishing of 4H-SiC substrate

Zhang

¹

,

Yang

²

,

Qiu

³

2021

Int J Adv Manuf Technol

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Silicon carbide (SiC) has been a promising the-third-generation semiconductor power device material for high-power, high-temperature, substrate applications. It aims to improve the material removal rate (MRR), on the premise of ensuring the surface roughness requirements of the double-faced mechanical polishing of 6-inch SiC substrate. To obtain the relationship between any point on SiC substrate and polishing pads, the model about double-faced mechanical polishing has been built and the kinematics equations were created. Best optimized material removal rate parameters were obtained. MRR reached the maximum when speed rate of the outside ring gear to the inside sun gear m=-1, speed rate of lower plate to the inside sun gear n=5, SiC substrate distribution radius RB=75. The primary and secondary order of MRR (n>m>RB) was obtained. An accurate mathematical model of orthogonal rotary regression test of Tri-factor quadratic of MRR was established and the regression model was significant. Surface quality of SiC substrate was observed and characterized with SEM and AFM. It greatly provides a key guarantee for the next process of CMP, confirmed the importance of MRR to ultra-smooth polishing, and provides a guarantee for its application in semiconductor equipment and technology.

show abstract

“…5 and Table 6. [20,21], and the regression equation was obtained by fitting the ternary quadratic polynomial. Pareto Chart of t-Values for Coefficients was shown in Fig.…”

Section: Fig 3 Proportion Of the Influence Of Parameters On Mrrmentioning

confidence: 99%

Material Removal Rate of Double-faced Mechanical Polishing of 4H-SiC Substrate

Zhang

¹

,

Yang

²

,

Qiu

³

2021

Preprint

View full text Add to dashboard Cite

Silicon carbide (SiC) has been a promising the-third-generation semiconductor power device material for high-power, high-temperature, substrate applications. It aims to improve the material removal rate (MRR), on the premise of ensuring the surface roughness requirements of the double-faced mechanical polishing of 6-inch SiC substrate. To obtain the relationship between any point on SiC substrate and polishing pads, the model about double-faced mechanical polishing has been built and the kinematics equations were created. Best optimized material removal rate parameters were obtained. MRR reached the maximum when speed rate of the outside ring gear to the inside sun gear m=-1, speed rate of lower plate to the inside sun gear n=5, SiC substrate distribution radius RB=75. The primary and secondary order of MRR (n>m>RB) was obtained. An accurate mathematical model of orthogonal rotary regression test of Tri-factor quadratic of MRR was established and the regression model was significant. Surface quality of SiC substrate was observed and characterized with SEM and AFM. It greatly provides a key guarantee for the next process of CMP, confirmed the importance of MRR to ultra-smooth polishing, and provides a guarantee for its application in semiconductor equipment and technology.

show abstract

Analysis and optimization of parameters in optical polishing of large diameter BK7 flat components

Cited by 15 publications

References 26 publications

Investigation Into Levitating Polishing Disc Used for Flat Surface Finishing

Investigation Into Levitating Polishing Disc Used for Flat Surface Finishing

Material removal rate of double-faced mechanical polishing of 4H-SiC substrate

Material Removal Rate of Double-faced Mechanical Polishing of 4H-SiC Substrate

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