2006 European Solid-State Device Research Conference 2006
DOI: 10.1109/essder.2006.307680
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Analysis of a Novel Electrically Programmable Active Fuse for Advanced CMOS SOI One-Time Programmable Memory Applications

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Cited by 8 publications
(4 citation statements)
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“…On the other hand, in the hard-programmed state, the values of I sweep are smaller and more stable. The two similar resistance groups also seem to appear in p-fuses programmed with moderate pulsed currents [9], [10].…”
Section: B Observations Of Cpmentioning
confidence: 84%
“…On the other hand, in the hard-programmed state, the values of I sweep are smaller and more stable. The two similar resistance groups also seem to appear in p-fuses programmed with moderate pulsed currents [9], [10].…”
Section: B Observations Of Cpmentioning
confidence: 84%
“…Therefore, four minimum size pmos transistors can be used as the power transistors. Then, an electrical fuse can be programmed with the configuration to turn on one of the pmos transistors [4]. In terms of area, the four minimum sized pmos transistors would be 0.12 µm 2 .…”
Section: Area Overheadmentioning
confidence: 99%
“…We measured the energy for each bitline using (4). Each column's bitline was pre-charged to 1 V. We then determined the amount of development for each SRAM instance in a particular column.…”
Section: Experiments a Setupmentioning
confidence: 99%
“…It allows more traces of poly and back-end-of-line (BEoL) metal layers overpassing above the fuse area to acquire a high pattern compactness that is comparable to conventional polysilicon fuse and BEoL metal fuse structures. The active fuse has been implemented in an SOI process in a previous study; 4 however, its result is insufficient to meet the reliable requirement for the current product applications. For cost concerns, the active fuse has less process procedures than that of the polysilicon counterpart, in which a mechanical memorize layer is used to boost its programming ability.…”
mentioning
confidence: 99%