2015 30th Symposium on Microelectronics Technology and Devices (SBMicro) 2015
DOI: 10.1109/sbmicro.2015.7298148
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Analysis of analog parameters in NW-TFETs with Si and SiGe source composition at high temperatures

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Cited by 8 publications
(6 citation statements)
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“…Device research has shifted toward new architectures, materials, and technologies to enable "More than Moore" paradigms, [4] extending the mature Si complementary metal-oxidesemiconductor (CMOS) platform. [5] In this regard, Si 1−x Ge x and Ge active regions integrated on Si platforms are promising candidates for future optoelectronic devices [6] and the realization of energy efficient steep subthreshold switches such as band-to-band tunneling transistors (TFETs), [7,8] negative capacitance Ge nanowire FETs, [9,10] and positive feedback FETs. [11] Conventionally, degenerately doped semiconductor regions in combination with thin layers made of transition-metal semiconductor alloys, such as metalsilicides [12] and metal-germanides, [13] have been used to obtain ohmic contacts to most Si 1−x Ge x and Ge based devices.…”
mentioning
confidence: 99%
“…Device research has shifted toward new architectures, materials, and technologies to enable "More than Moore" paradigms, [4] extending the mature Si complementary metal-oxidesemiconductor (CMOS) platform. [5] In this regard, Si 1−x Ge x and Ge active regions integrated on Si platforms are promising candidates for future optoelectronic devices [6] and the realization of energy efficient steep subthreshold switches such as band-to-band tunneling transistors (TFETs), [7,8] negative capacitance Ge nanowire FETs, [9,10] and positive feedback FETs. [11] Conventionally, degenerately doped semiconductor regions in combination with thin layers made of transition-metal semiconductor alloys, such as metalsilicides [12] and metal-germanides, [13] have been used to obtain ohmic contacts to most Si 1−x Ge x and Ge based devices.…”
mentioning
confidence: 99%
“…Starting from a substrate with high arsenic doping which is used as the drain, the channel and source are obtained by blanket epitaxial growth, for the NW TFET (NW-TFET) the source is obtained with a in situ borondoped SiGe layer [20], while for the NW MOSFET (NW-MOSFET) arsenic is used [21], detailed information about the fabrication can be found in [21]. The use of SiGe in the source increases the drain current preserving the good analog behavior [22,23].…”
Section: Devices Overviewmentioning
confidence: 99%
“…The measured MOSFETs have only Si in the channel, source, and drain regions. The isolated characteristics of the transistors have already been extensively studied in previous works [21][22][23][24][25][26]. A schematic of the devices is shown in figure 1.…”
Section: Devices Descriptionmentioning
confidence: 99%
“…The transistors used in this study have already been extensively studied at a device level [18][19][20][21][22][23][24][25][26], but not at circuit level. Therefore, a simple, well-known topology was chosen so that the characteristics of the different devices and its effects in the OTA performance can be analyzed without worries about circuit complexity.…”
Section: Introductionmentioning
confidence: 99%