Analytical investigation of flat silicon micro heat spreaders

Abstract

Conventional methods of cooling are not an ideal way to overcome the heat problem in power electronics today. A simple solution would be using micro heat spreader as an integrated part in the silicon substrate. This investigation presents a detailed analysis on maximum heat transfer capabilities of silicon-water cooling devices, flat plate micro heat spreaders. The predictive hydraulic and thermal models were developed to define the heat spreader thermal performances and capillary limitations. Theoretical results of the maximal heat flux that could be transferred agreed reasonably well with the experimental data and the developed model provides a better understanding of the heat transfer capability of micro heat spreaders.

Theoretical and Experimental Analysis of Flows and Heat Transfer Within Flat Mini Heat Pipe Including Grooved Capillary Structures

“…The effect of the dry-out or flooding phenomena on the FMHP performance, according to boundary conditions and fluid fill charge, can also be predicted. Tzanova et al (2004) presented a detailed analysis on maximum heat transfer capabilities of silicon-water FMHPs. The predictive hydraulic and thermal models were developed to define the heat spreader thermal performances and capillary limitations.…”

Geometric optimization for a thermal microfluidic chip

“…Micro heat spreaders are typically planar circular structures with layers of radial channels [17]. Schematic configuration and operation of a typical micro heat spreader are shown in Figure 2-2.…”

FEA Calculations for Ultra Thin Piezoresistive Pressure Sensor on SOI for Heatspreader Integration

“…1, the pressure sensor membrane is micromachined in the heat spreader wall in order to be able to measure accurately the pressure inside the cavity. Therefore the membrane size is dependent on the channel width, which in return has to be optimized in order to assure an efficient liquid pumping [4]. For the specific heat spreader dimensions ( Fig.…”

“…Tests carried out on several specific designs are showing their considerable improvement with respect to thermal conductivity (up to 10 times the thermal conductivity of Si bulk [2]). The modeling background for optimizing a specific spreader design is also available [3,4], although it needs further testing for specific applications. In this context internal pressure, temperature and flow sensors are vital assets to this kind of study in order to reach an optimal configuration that will allow a maximized dissipated heat flux for a maximized compactness.…”