outstanding performance in facilitating heat dissipation, the high material density and rigidity made them inefficient for weight-saving portable devices, soft electronics, and heat exchangers of various form factors. Polymer/fillers composites are promising heat dissipation materials for thermal management systems. For example, the thermally conductive fillers such as hexagonal boron nitride, [3,4] Cu nanowire, [5,6] Ag nanowire, [6,7] aluminum nitride, [8,9] carbon nanotubes, [10] and graphene [11] can be dispersed in polymer matrix, and the composites showed thermal conductivity of ≈8 W mK −1 . A higher loading amount of the filler improves the higher thermal conductivity, however, the stiffness of the composite also increased simultaneously. [12] To overcome the limitation, liquid metal-based composite has been adopted. Since liquid metal such as eutectic gallium-indium (EGaIn) has a liquid phase at room temperature, infinitely deformable, electrical conductivity, and thermal conductivity, [13][14][15] soft and deformable composite can be achieved by the incorporation of the liquid metal filler. For this reason, the liquid metal has been utilized in not just only heat dissipation application but also flexible electrode, [16][17][18] deformable energy storage, [19,20] and soft dielectric material. [21][22][23][24] Recently, the liquid metal incorporated elastomer has shown the potential for soft materials with good thermal conductivity. For example, Bartlett et al. reported the liquid metal/polydimethylsiloxane (PDMS) composite for the thermally conductive elastomer. [25,26] The elastomer, which was prepared by the shear-mixing method, was composed of commercial PDMS (Ecoflex 00-30) and EGaIn microparticles with ≈10 1 µm. When the composite was stretched, the anisotropic shape deformation of EGaIn microparticles was induced and aligned with a parallel stretching direction. At this condition, the thermal conductivity of stretching direction was enhanced, whereas that of transverse direction of stretching was slightly decreased. Accordingly, the anisotropic heat dissipation performance of the composite was shown depending on the stretching. Although the commercial PDMS (Ecoflex00-30)/EGaIn microparticles composite claims thermal transport without sacrificing elastic properties, several issues are still remaining. For example, formation of electrically conductive path is one of the issues. Typically, as prepared PDMS/EGaIn microparticle composite is The emergence of soft electronics has led to the need for thermal management with deformable material. Recent efforts have focused on incorporating EGaIn microparticles (≈10 1 µm) into elastomer forming a thermal conductive composites. However, the shape deformation and coalescence of EGaIn particles under mechanical stress often lead to parasitic electrical conduction, imposing limitations on its utilization in thermal management. Increasing the loading of EGaIn nanoparticles (>20 vol%) often leads to brittleness of the composite. Herein, a strategy to obtain thermal...