2007
DOI: 10.1109/tpel.2007.900557
|View full text |Cite
|
Sign up to set email alerts
|

Anode Engineering for the Insulated Gate Bipolar Transistor—A Comparative Review

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

1
11
0

Year Published

2011
2011
2025
2025

Publication Types

Select...
8

Relationship

0
8

Authors

Journals

citations
Cited by 24 publications
(12 citation statements)
references
References 21 publications
1
11
0
Order By: Relevance
“…h p has alternatively been related to the Gummel number G by G = 1/h p , although such a relationship should be used with care [46]. In [47] the effect of varying the Gummel number, i.e. h p , on the on-state/switching loss trade-off is studied.…”
Section: A Dependence Of Stored Charge On Emitter Recombinationmentioning
confidence: 99%
See 1 more Smart Citation
“…h p has alternatively been related to the Gummel number G by G = 1/h p , although such a relationship should be used with care [46]. In [47] the effect of varying the Gummel number, i.e. h p , on the on-state/switching loss trade-off is studied.…”
Section: A Dependence Of Stored Charge On Emitter Recombinationmentioning
confidence: 99%
“…The second term is that expected from recombination into the anode under high-level injection conditions. Assuming that I n1 is given by bI C /(b + 1), substitution of this into equation (47) results in an effective emitter recombination parameter h p(ef f ) :…”
Section: B Emitter Recombination Through a Buffer Layermentioning
confidence: 99%
“…The AG-RC-IGBTs have the parasitic n-p-n transistor at their anode sides. The n-p-n transistor provides an electron extraction path during the turn-off of the IGBT, which can reduce the turn-off time and loss [12]. In Figs.…”
Section: B Transient Characteristicsmentioning
confidence: 99%
“…When compared with metal oxide semiconductor field effect transistors, they do have to connect an anti-parallel diode across the IGBT structure and this leads to additional area consumption to accommodate the on-chip diodes. Consequently, lots of reverse conducting vertical IGBTs and the shorted anode LIGBTs have been proposed and discussed [6][7][8]. However, it is difficult to keep the snap-back voltage very low and optimise the same silicon for both the modes while maintaining good reverse conduction through the body diode.…”
Section: Introductionmentioning
confidence: 99%