Antibacterial activity of copper coating electrodeposited on 304 stainless steel substrate

Isa, Nik Norziehana Che; Mohd, Yusairie; Mohamad, Sharifah Aminah Syed; Zaki, Mohammad Hafizudden Mohd

doi:10.1063/1.5010446

Cited by 5 publications

(5 citation statements)

References 14 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In this potential regime, well-grown grains are seen. The grain morphology is faceted at small Cu depositions overpotentials, which is a characteristic of Cu electrodeposition[42][43][44]. Below the redox potential of the Ru surface oxide, the films are compact, with smaller grain sizes at higher deposition overpotentials.…”

mentioning

confidence: 99%

Electrodeposition of Cu-Ag Alloy Films at n-Si(001) and Polycrystalline Ru Substrates

2021

View full text Add to dashboard Cite

Electrodeposition of Cu-Ag films from acidic sulfate bath was conducted at n-Si(001) and polycrystalline Ru substrates. Significant nucleation overpotential of 0.4 V is observed with the Cu-Ag bath at n-Si(001) substrate, whereas the electrodeposition of Cu-Ag at Ru substrate is influenced by Ru oxides at the surface. Incomplete coverage of Si substrate by Cu-Ag deposit was observed from the deposition systems without Ag(I), or with 0.1 mM Ag(I), comparing with the compact Cu-Ag film obtained with the deposition bath containing 0.01 mM Ag(I). Layered and faceted Cu-Ag deposit was observed at small Cu deposition overpotential with the Ru substrate. Phase composition of the Cu-Ag deposits at n-Si(001) substrate from electrolyte with various Ag(I) concentrations is examined by XRD. Limited solubility of Ag (0.4 at.%) was observed in fcc-Cu until phase separation occurs. The classical model for nucleation kinetics in electrodeposition was used to examine the potentiostatic transients of the Cu-Ag electrodeposition at n-Si(001) substrate.

show abstract

mentioning

confidence: 99%

Electrodeposition of Cu-Ag Alloy Films at n-Si(001) and Polycrystalline Ru Substrates

2021

View full text Add to dashboard Cite

show abstract

“…Similar to the morphology of the Cu coatings, the largest effect on crystal structure (i.e., on the preferred orientation of coating) has the type of electrolyte [5,47]. In both the constant (potentiostatic and galvanostatic) regimes of electrodeposition, the Cu coatings obtained from the basic sulfate electrolyte possessed the (220) preferred orientation, and this preferred orientation did not depend on applied current density or potential, type of cathode used, and concentrations of both Cu(II) ions and sulfuric acid as constituents of the sulfate electrolyte [4,5,48,49]. On the other hand, the mirror bright Cu coatings obtained here used levelling and brightening additives exhibited the strong (200) preferred orientation [5,47].…”

Section: Discussionmentioning

confidence: 99%

“…Various processes of copper electrodeposition on different bulk materials were devel-oped for micro electro mechanical systems devices (MEMS), through-hole plating for printed circuit boards (PCBs), as well as for all other conventional functional plating processes on silicon, brass, steel, copper, etc. [3][4][5]. Copper coatings are the most commonly used material for interconnections within microelectronics.…”

Section: Introductionmentioning

confidence: 99%

Structural, Mechanical and Electrical Characteristics of Copper Coatings Obtained by Various Electrodeposition Processes

et al. 2022

View full text Add to dashboard Cite

Mechanical (hardness and adhesion) and electrical (sheet resistance) characteristics of electrolytically produced copper coatings have been investigated. Morphologies of Cu coatings produced galvanostatically at two current densities from the basic sulfate electrolyte and from an electrolyte containing levelling/brightening additives without and with application of ultrasound for the electrolyte stirring were characterized by SEM and AFM techniques. Mechanical characteristics were examined by Vickers microindentation using the Chen–Gao (C–G) composite hardness model, while electrical characteristics were examined by the four-point probe method. Application of ultrasound achieved benefits on both hardness and adhesion of the Cu coatings, thereby the use of both the larger current density and additive-free electrolyte improved these mechanical characteristics. The hardness of Cu coatings calculated according to the C–G model was in the 1.1844–1.2303 GPa range for fine-grained Cu coatings obtained from the sulfate electrolyte and in the 0.8572–1.1507 GPa range for smooth Cu coatings obtained from the electrolyte with additives. Analysis of the electrical characteristics of Cu coatings after an aging period of 4 years showed differences in the sheet resistance between the top and the bottom sides of the coating, which is attributed to the formation of a thin oxide layer on the coating surface area.

show abstract

“…Steel is a metallic material with many applications in different industries as a structural material [1], for medical applications [2], for electronics or electrodes in energy sources [3,4] and also in daily life [5][6][7]. In many of these applications, it is necessary to modify the steel surface to improve the surface properties [1,8].…”

Section: Introductionmentioning

confidence: 99%

“…Depending on the purpose of the copper plating, various electrolytes containing copper ions are used for copper electrodeposition, cyanide bath being the one most often used [26]. Copper metallic coating is not only used as a protection against corrosion, but also because of its excellent electrical and thermal conductivity; it can be easily fabricated, has a low cost [27] and also has antibacterial properties [2]. Using reinforcements, a composite coating with improved properties can be obtained [28].…”

Section: Introductionmentioning

confidence: 99%

Influence of Carbon Nanowalls Interlayer on Copper Deposition

et al. 2021

View full text Add to dashboard Cite

This research deals with the deposition of copper on a steel substrate. Two different methods were investigated: electrochemical and magnetron sputtering. The deposition parameters were optimized to obtain a coating layer with uniform granular structure and good adhesion to the substrate. As a novelty, carbon nanowalls (CNW) were used as reinforcement in copper coatings on the steel surface. The morphology of the coatings, adhesion and Vickers microhardness were performed to emphasize the CNW influence on the coating properties. Open circuit potential and Tafel analysis were used for electrochemical characterization. These kinds of CNW-copper composite with improved hardness and adhesion and surface electrical resistance around 1 Ω·cm could have miscellaneous applications in different domains such as aerospace, electronics, automotive and power-generation.

show abstract

Antibacterial activity of copper coating electrodeposited on 304 stainless steel substrate

Cited by 5 publications

References 14 publications

Electrodeposition of Cu-Ag Alloy Films at n-Si(001) and Polycrystalline Ru Substrates

Electrodeposition of Cu-Ag Alloy Films at n-Si(001) and Polycrystalline Ru Substrates

Structural, Mechanical and Electrical Characteristics of Copper Coatings Obtained by Various Electrodeposition Processes

Influence of Carbon Nanowalls Interlayer on Copper Deposition

Contact Info

Product

Resources

About