“…After the desired material is deposited on the substrate, the photolithography process starts with spin coating the substrate with a photoresist [204]. Hence, a polymeric photosensitive material can be spun onto the wafer in liquid from an adhesion promoter (such as hexamethyldisilazane, Si(CH 3 ) 3 NHSi(CH 3 ) 3 , HMDS) used prior to the application of the resist.…”