Application of multi-quality parameter design in the optimization of underfilling process – a case study of a vehicle electronic module

Huang, Chien‐Yi; Shen, Li-Ching; Wu, Ting-Hsuan; Greene, Christopher

doi:10.1108/ssmt-05-2020-0016

Cited by 8 publications

(4 citation statements)

References 19 publications

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“…The experimental data of two quality characteristics, such as the standard deviation of solder paste volume and 01005 assembly yield, are obtained in this study, as shown in Table 1, respectively. The SN ratio is calculated, and the influence of various factors on quality characteristics is displayed by a response table and a response graph, and the optimum parameter combination is proposed using the TOPSIS multi-quality analysis method (Huang et al , 2020).…”

Section: Discussionmentioning

confidence: 99%

Design criteria for pad and stencil with high pick-and-Place yield

Huang

Greene

Chan

et al. 2021

SSMT

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Purpose This study aims to focus on the passive components of System in Package SiP modules and discusses the geometric pad designs for 01005-sized passive components, the front end design of the hole size and shape of the stencil and the parameters of the stencil sidewall coating, to determine the optimum parameter combination. Design/methodology/approach This study plans and conducts experiments, where a L8(27) inner orthogonal array is built to consider the control factors, including a L4(23) outer orthogonal array to consider the noise factor, and the experimental data are analyzed by using the technique for order preference by similarity to ideal solution multi-quality analysis method. Findings The results show that the optimum design parameter level combination is that the solder mask opening pad has no solder mask in the lower part of the component, the pad width is 1.1 times that of the component width, the pad length is 1.75 times that of the electrode tip length, the pad spacing is 5 mil, the stencil open area is 90% of the pad area, the stencil opening corner has a 3 mil chamfer angle, and the stencil sidewall is free of nano-coating. Originality/value The parameter design and multi-quality analysis method, as proposed in this study, can effectively develop the layout of passive components on a high-density SiP module substrate, to stabilize the process and increase the production yield.

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Section: Discussionmentioning

confidence: 99%

Design criteria for pad and stencil with high pick-and-Place yield

Huang

Greene

Chan

et al. 2021

SSMT

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“…Obtain a single measurement index by using GRA to calculate gray relational coefficients of the various principal component. Determine the optimal process parameter set objectively and effectively (Vimal et al, 2017;Chiang et al, 2006;Lu et al, 2009;Huang et al, 2020). The analysis process is described as follows:…”

Section: Principal Component Gray Relational Analysismentioning

confidence: 99%

Improving the electromagnetic compatibility of electronic products by using response surface methodology and artificial neural network

Chen¹,

Huang²,

Huang³

2021

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Purpose The purpose of this study is to use the Taguchi Method for parametric design in the early stages of product development. electromagnetic compatibility (EMC) issues can be considered in the early stages of product design to reduce counter-measure components, product cost and labor consumption increases due to a number of design changes in the R&D cycle and to accelerate the R&D process. Design/methodology/approach The three EMC characteristics, including radiated emission, conducted emission and fast transient impulse immunity of power, are considered response values; control factors are determined with respect to the relevant parameters for printed circuit board and mechanical design of the product and peripheral devices used in conjunction with the product are considered as noise factors. The optimal parameter set is determined by using the principal component gray relational analysis in conjunction with both response surface methodology and artificial neural network. Findings Market specifications and cost of components are considered to propose an optimal parameter design set with the number of grounded screw holes being 14, the size of the shell heat dissipation holes being 3 mm and the arrangement angle of shell heat dissipation holes being 45 degrees, to dispose of 390 O filters on the noise source. Originality/value The optimal parameter set can improve EMC effectively to accommodate the design specifications required by customers and pass test regulations.

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“…Conventional underfill materials used in capillary-driven flow are composed of thermoset epoxy polymers with silica filler particles [ 7 , 8 ], generally demonstrating a slow flow rate owing to their high viscosity. Hence, a complete filling of the chip-to-substrate standoff and shortening of the filling time have been regarded as technical challenges [ 9 , 10 ] in capillary-driven flow. Various studies have claimed that capillary-driven flow can be enhanced by modifying the surface wettability [ [11] , [12] , [13] , [14] ], driving pressure gradient [ 15 ], thermal stresses [ [16] , [17] , [18] ], and electric field effects [ [19] , [20] , [21] , [22] ].…”

Section: Introductionmentioning

confidence: 99%