Advances in Electronic Packaging, Parts A, B, and C 2005
DOI: 10.1115/ipack2005-73053
|View full text |Cite
|
Sign up to set email alerts
|

Artificial Neural Network Trained, Genetic Algorithms Optimized Thermal Energy Storage Heatsinks for Electronics Cooling

Abstract: A thermal response model for designing thermal energy storage heatsink utilized for electronics cooling is developed in this paper. In this study, thermal energy storage (TES) heatsink made out of aluminum with paraffin as the phase change material (PCM) is considered. By using numerical simulation, stabilization time and maximum operating temperature to transition temperature difference is obtained for varying fin thicknesses, fin height, number of fins and PCM volume. The numerical simulation results were th… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2012
2012
2023
2023

Publication Types

Select...
3

Relationship

0
3

Authors

Journals

citations
Cited by 3 publications
(1 citation statement)
references
References 0 publications
0
1
0
Order By: Relevance
“…The results showed that the pin-fin angle has the greatest impact on Nusselt and Poiseuille numbers. Kanesan et al [29] developed a response model for thermal energy storage heat sinks, which are commonly used to cool electronics. They examined an aluminum heat sink for thermal energy storage (TES) using paraffin as the phase change material (PCM).…”
Section: Introductionmentioning
confidence: 99%
“…The results showed that the pin-fin angle has the greatest impact on Nusselt and Poiseuille numbers. Kanesan et al [29] developed a response model for thermal energy storage heat sinks, which are commonly used to cool electronics. They examined an aluminum heat sink for thermal energy storage (TES) using paraffin as the phase change material (PCM).…”
Section: Introductionmentioning
confidence: 99%