Assembled micro-electromechanical-systems microcolumn from a single layer silicon process

Saini, Rahul; Jandric, Z.; Tsui, K.; Udeshi, Tushar; Tuggle, David W.

doi:10.1116/1.1815311

Cited by 12 publications

(11 citation statements)

References 12 publications

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“…The sockets and the connectors are also designed to preserve the finite amount of the stress in the assembled position so that the 3D structure is 'pre-stressed' before being loaded in the actual application. Similar assembly procedures were used in our previous work [13,14] that demonstrated the assembly feasibility of a microcolumn. We will not talk about the details of our assembly process here, since its details can be found elsewhere [11,12], but a very important outcome of our assembly procedure is the assembly accuracy.…”

Section: Mems Assemblymentioning

confidence: 81%

“…The process steps are elaborated in our previous work [13,14]. We start with an silicon on insulator (SOI) wafer with a 2 lm buried oxide (BOX) layer sandwiched between a 50 lm thick single crystal silicon (SCS) device layer and 500 lm handle (substrate).…”

Section: Mems Fabrication Processmentioning

confidence: 99%

“…Our first generation microcolumn feasibility design closely followed the ETEC microcolumn geometry [2] and encountered two major problems: the extensive heating from Schottky emitter, and complex assembly of the two deflectors with 16 subassemblies that increased misalignment [13].…”

Section: Microcolumn Designmentioning

confidence: 99%

“…The method reported in this paper is an extension of our previous work [13,14] which now incorporates a design tailored for miniature electron optics application to build a manufacturable and inexpensive microcolumn using automated assembly.…”

Section: Introductionmentioning

confidence: 97%

“…Our manufacturing technique takes advantage of high precision and low-cost silicon processing to fabricate microcolumn components and uses automated assembly [11,12] to assemble the microcolumn. We presented assembly feasibility analysis using a mechanical prototype for manufacturing these MEMS microcolumn in Saini et al [13]. Subsequently, the first generation microcolumn design that closely follows Etec's microcolumn specs with reduced assembly complexity and low-voltage operation was presented in Saini et al [14].…”

Section: Introductionmentioning

confidence: 97%

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Manufacturable MEMS miniSEMs

Saini

Jandric

Gammell

et al. 2006

Microelectronic Engineering

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Section: Mems Assemblymentioning

confidence: 81%

Section: Mems Fabrication Processmentioning

confidence: 99%

Section: Microcolumn Designmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 97%

Section: Introductionmentioning

confidence: 97%

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Manufacturable MEMS miniSEMs

Saini

Jandric

Gammell

et al. 2006

Microelectronic Engineering

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Ultrathin Fullerene Films as High‐Resolution Molecular Resists for Low‐Voltage Electron‐Beam Lithography

Gibbons

Robinson

Palmer

et al. 2006

Small

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Since the discovery of C 60 , [1] attempts to utilize the unique properties of fullerene molecules have been widespread. [2] One field of particular interest is the potential use of novel fullerene-based materials within the semiconductor industry, [3] where the interplay between new materials and new technologies is always of vital importance. Two such emerging technologies proposed for next-generation lithography are arrayed microcolumns [4] and multiple electron-beam (ebeam) systems, [5] both of which have recently shown promise. [6] In the former, multiple electron guns are used to create an array of individually controlled beams, while the latter uses a single large beam split by an aperture plate into many concurrently controlled beams. In each case a massive parallelization of the system should allow greatly enhanced patterning speeds. As these technologies will most likely operate in the low ebeam energy regime (below 5 keV), the requirement for high-resolution resists suitable for low energies is becoming increasingly important. Significantly, because low-energy electrons have a dramatically reduced penetration depth, re-sists with ultrahigh etch durability become vital due to the fact that only thin films of resist can be used.C 60 itself can be used as a negative-tone e-beam resist with extremely high etch resistance. [7] However, pure C 60 films require preparation via vacuum sublimation and also need an extremely high electron dose, in the region of 12 mC cm À2 , to change the dissolution rate in organic solvents. Previous studies by Robinson and co-workers showed that films of C 60 derivatives could be cast by the more conventional spin-coating technique, while achieving an order of magnitude increase in sensitivity. [8,9] It was also shown that 20-nm features could be patterned in the resist, while maintaining an etch durability six times that of silicon (in electron cyclotron resonance (ECR) microwave plasma etching with SF 6 ). [9] Electron-beam energies of 20 to 30 keV were employed in all of this prior work. Herein, we report the performance of the multiaddend methanofullerenes MF02-01A and MF03-01 (Scheme 1) when the e-beam energy is reduced to the low-energy regime, specifically 0.2 to 5 keV. The synthesis of these derivatives will be presented elsewhere. [10] Samples of the methanofullerenes were dissolved in chloroform and deposited by spin coating on hydrogen-terminated silicon < 100 > samples, approximately 4 cm 2 in size. Sample concentrations ranged from 1 to 20 g L À1 , which resulted in film thicknesses of between 10 and 120 nm. Anisole was also found to be an effective casting solvent. The sensitivity of these resist films to e-beam irradiation at energies below 5 keV was investigated using a FEI XL30SFEG scanning electron microscope equipped with a pattern generator for lithography (Raith Elphy Quantum). The samples were exposed to various electron doses between 5 and 5000 mC cm À2 , and were then developed in a suitable solvent such as monochlorobenzene (MCB) before rinsing in i...

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Design of a Module That Can Self‐Organize and Self‐Replicate

Nozawa

Matsumoto

2018

IEEJ Transactions Elec Engng

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In this paper, we describe a design of a module that can self-organize and self-replicate. Self-organization is the function or phenomenon of building an autonomously ordered structure from a simple part. Self-replication is the function or phenomenon of mass production of the same substance as the target substance. Both have convenience and inconvenience. In this paper, we report the design of a module that can self-organize and self-replicate to cover each inconvenience in a complementary style. Through experiments, we confirm that the designed modules have the potential to achieve both self-organization and self-replication.

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Assembled micro-electromechanical-systems microcolumn from a single layer silicon process

Cited by 12 publications

References 12 publications

Manufacturable MEMS miniSEMs

Manufacturable MEMS miniSEMs

Ultrathin Fullerene Films as High‐Resolution Molecular Resists for Low‐Voltage Electron‐Beam Lithography

Design of a Module That Can Self‐Organize and Self‐Replicate

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