2003
DOI: 10.1063/1.1597749
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Atomic arrangement at the AlN/Si (111) interface

Abstract: High-quality GaN epilayers have been grown on Si (111) substrates by metalorganic vapor phase epitaxy using a low-temperature AlN nucleation layer. The atomic arrangement at the epilayer/substrate interface has been investigated by high-resolution electron microscopy. A crystallographically abrupt interface is observed along most of the epilayer, indicating that the AlN/Si interface is thermodynamically stable and of high crystalline quality. Lattice images at the interface show a periodic array of misfit disl… Show more

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Cited by 124 publications
(79 citation statements)
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“…The multiplicity of interfacial structures that has been proposed for the III-N/silicon interface with the (0001)/(111), 〈2110〉/〈110〉 epitaxial orientation relationship [20] necessitates a topological study of possible interfacial structure transformations. A similar analysis has been performed so far only for homophase hcp(0001)/fcc(111) [27].…”
Section: Interfacial Structures and Topological Methodologymentioning
confidence: 99%
See 3 more Smart Citations
“…The multiplicity of interfacial structures that has been proposed for the III-N/silicon interface with the (0001)/(111), 〈2110〉/〈110〉 epitaxial orientation relationship [20] necessitates a topological study of possible interfacial structure transformations. A similar analysis has been performed so far only for homophase hcp(0001)/fcc(111) [27].…”
Section: Interfacial Structures and Topological Methodologymentioning
confidence: 99%
“…In the model interfaces of Fig. 2 we have considered the possibility that either Al or N atoms may comprise the first layer bonded to Si [20]. For analysis of structural transformations between multiple interfacial structures it is helpful to employ bicrystal structure maps or 'cells of non-identical displacements' (cnids) [25].…”
Section: Interfacial Structures and Topological Methodologymentioning
confidence: 99%
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“…Alternatively, Si is an attractive substrate due to its ultra-high crystal quality, low cost, large wafer size (up to 18 inches) availability, and easy integration in integrated circuits industry. However, large mismatches in lattice and thermal expansion coefficients between Si and GaN lead to the formation of poor quality GaN film and generation of cracks, and the high reactivity of atomic nitrogen to Si tends to form an amorphous SiN x layer at the interface [7] that would impede local epitaxial GaN growth and result in growth inhomogeneity [8].…”
Section: Introductionmentioning
confidence: 99%