Deposition of high-k dielectric thin films is essential
for manufacturing
modern electronic devices. Atomic layer deposition (ALD) is an attractive
technology for depositing high-k materials because it exhibits conformality
and facilitates thickness control of the films at the atomic level.
It has been suggested that high-temperature ALD can enhance the material
properties of the deposited films such as density and crystallinity,
for which the development of thermally stable precursors that deliver
the metallic element is required. Heteroleptic titanium (Ti), zirconium
(Zr), and hafnium (Hf) precursors containing amido and cyclopentadienyl
(Cp) ligands have recently been introduced, with some demonstrating
improved thermal stability. However, the mechanism behind the improved
thermal stability of these precursors remains unclear. This research
employs density functional theory (DFT) calculations to elucidate
the role of Cp ligands of group 4 (Ti, Zr, Hf) precursors for high-temperature
ALD. The surface adsorption reactions of the precursors on oxide surfaces
are suggested to be facile. For most precursors, one or two ligands
are thought to exist after chemical adsorption. Cp ligands, in particular,
are expected to persist on the surface, whereas amido ligands are
more easily eliminated during adsorption. The decomposition of the
precursor after adsorption on the surface then is considered, for
which the thermal stability is significantly enhanced by introducing
the Cp ligand. Furthermore, precursors with Cp ligands are more difficult
to adsorb on the partially decomposed precursor-on-surface. Our findings
intend to offer a fundamental molecular-level understanding of the
thermal stability of group 4 precursors for high-temperature ALD.