Authentication Using Metallic Inkjet-Printed Chipless RFID Tags

Ali, Zeshan; Perret, Etienne; Barbot, Nicolas; Siragusa, Romain; Hély, David; Bernier, Martin; Garet, Frédéric

doi:10.1109/tap.2019.2948740

Cited by 23 publications

(20 citation statements)

References 18 publications

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“…Just as there are application-specific measurement approaches, there are also application-specific post-processing methods. For example, post processing methods have been developed for specific sensor architectures [157,350,351], for authentication purposes [189,207,325,345,352], and for decoding responses measured from moving tags [337,346,[353][354][355]. Another application that has seen many specifically developed post-processing methods is collision avoidance/tag localization in multi-tag environments [247,248,[356][357][358].…”

Section: Application Specific Post-processingmentioning

confidence: 99%

A Review of Chipless RFID Measurement Methods, Response Detection Approaches, and Decoding Techniques

Brinker

Zoughi

2022

IEEE Open J. Instrum. Meas.

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Chipless RFID systems can be considered as a special case of passive RFID systems, where the tag contains no power source and no electronics. Instead, the tag's information is stored in its structure and accessed through its electromagnetic (EM) scattering response. However, robust response detection, which is primarily a function of the measurement method, measurement equipment, and processing method used, is still a major challenge in the chipless RFID field. The consequences of not properly capturing a tag response include, incorrectly assigning an ID or incorrectly reporting a sensing parameter. Due to the criticality of these challenges, this review seeks to provide an overview of the current measurement methods, equipment architectures, and processing methods as they relate to chipless RFID tag response detection and decoding. Since chipless RFID started gaining popularity around 2005, the developments in this area have been focused on three major categories: timedomain, frequency-domain, and spatial-domain systems. Frequency-domain systems have emerged as the most popular among these three categories, and thus, this review focuses on techniques used for these systems.

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Section: Application Specific Post-processingmentioning

confidence: 99%

A Review of Chipless RFID Measurement Methods, Response Detection Approaches, and Decoding Techniques

Brinker

Zoughi

2022

IEEE Open J. Instrum. Meas.

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“…Through sweeping the electrical signal input across a specified frequency range, a fingerprint specific to the manufacturer can be derived, while returning minute deviations from expected to accurately identify an IC die as being fabricated legitimately or maliciously. Authentication methods based on THz tagging have been used extensively in 2018 and 2019 to create automated techniques, 157,[166][167][168][169] along with methods of detecting spectral fingerprints from THz-tags behind shielded materials using machine learning. 170 Similar tagging methods have been combined with physically unclonable functions PUFs to create unclonable tags for protecting counterfeit pharmaceuticals, an industry plagued by counterfeits similar to semiconductors.…”

Section: Signals Emitted Under Testmentioning

confidence: 99%

Review of THz-based semiconductor assurance

True

Jessurun

et al. 2021

Opt. Eng.

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Terahertz radiation for inspection and fault detection has been of interest for the semiconductor industry since the first generation and detection of THz signals. Until recent hardware advances, THz systems lacked the signal quality and reliability for use as an effective nondestructive testing (NDT) method. Incremental advances in THz sources, detectors, and signal processing resulted in the successful applied-industrial use of THz NDT techniques on carbon fiber laminates, automotive coatings, and for detection of counterfeit pharmaceutical tablets. Semiconductor inspection and verification methods ensure the functionality and thereby safety of vital electronics for several critical industries. For this reason, the reliability and verification of a THz NDT method must exceed currently used inspection systems. With recent laboratory access to THz radiation, THz inspection methods are often compared with existing optical, electrical, and volumetric semiconductor verification techniques for their production monitoring and failure analysis viability. This review will cover THz techniques and their applications at the printed circuit board (PCB), integrated circuit (IC), and transistor/gate scales. The THz radiation gap spans between optical and electronic ranges with a millimeter-sized wavelength allowing for adequate penetration of plastic and ceramic and semiconductor materials. THz radiation can be used to determine structural features, electrical signatures in the THz range, and chemical information simultaneously. Cost and environmental limitations restricted the ability for THz NDT semiconductor inspection methods to escape the lab and succeed in the dynamic environment of a semiconductor fabrication environment. Hybridized metrology methods incorporating information from multiple inspection tools are a regime where THz spectral and structural data can be combined with existing methods such as optical, x-ray, or E-beam. THz can be used initially to offer support to the complex failure analysis and verification requirements of the semiconductor industry from nanoscale to macroscale features and components. For THz systems to become independent inspection tools used for semiconductor production monitoring, in the lab or fab, this will require a confident level of statistical process control for THz signal generation, detection, or processing. Applied industrial semiconductor device inspection will likely be a result of a combination of research into THz hardware, reconstruction techniques, and the widespread application of machine learning techniques. Many breakthroughs occurred over the years to enable successful nondestructive characterization and inspection of semiconductor devices from the nanoscale transistors to fully packaged integrated circuits and assembled PCBs.

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“…Compared with lithographical techniques, printing techniques have many advantages including simple processes, high efficiency, good compatibility for substrates, and extremely low costs. SP has yielded unusually brilliant results in the fabrication of flexible and large-area electronics on Earth, [8] such as organic light-emitting diodes (OLEDs), [8][9][10] radio frequency identification devices (RFIDs), [11][12][13] soft sensors, [14,15] etc. All these advantages make the printing technique a feasible and applicable strategy for manufacturing electronics in space.…”

Section: Introductionmentioning

confidence: 99%

Solution Printing of Electronics and Sensors: Applicability and Application in Space

Zhang

Ding

et al. 2022

Adv Eng Mater

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To ensure the safety and reliability of increasingly frequent, long‐duration, and long‐distance space missions, a sufficient and timely supply of the electronics and sensors that are essential in the maintenance and regeneration of spacecraft in space has become urgent. Solution‐based printing (SP) in space can be considered a disruptive technology for in situ manufacturing and maintenance of functional devices during the long duration and endurance of space exploration and crewed spaceﬂight. Herein, the origin and overview of the printing techniques in space are first introduced and further the printing processes in extreme space environments are discussed; then, its potential space applications in flexible solar cells, soft and wearable sensors, and space‐based antennas are forecast; finally, survivability for printed electronics in space is analyzed. Overall, a comprehensive description of the applicability and application of the SP techniques for manufacturing electronics and sensors in space is given.

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Authentication Using Metallic Inkjet-Printed Chipless RFID Tags

Cited by 23 publications

References 18 publications

A Review of Chipless RFID Measurement Methods, Response Detection Approaches, and Decoding Techniques

A Review of Chipless RFID Measurement Methods, Response Detection Approaches, and Decoding Techniques

Review of THz-based semiconductor assurance

Solution Printing of Electronics and Sensors: Applicability and Application in Space

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