Automated Two-Axes Optical Fiber Alignment Using Grayscale Technology

Morgan, Brian; McGee, J.; Ghodssi, Reza

doi:10.1109/jmems.2006.886035

Cited by 19 publications

(9 citation statements)

References 14 publications

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“…Other solutions require specialized fiber preparation such as attaching permanent magnets to the fiber end [5], gold coating and grounding to enable actuation of the fiber [6], or expensive fabrication techniques, such as LIGA [7]. Another example is silicon wedge fabrication using gray-scale lithography [8], which is a rather new technology and is currently lacking surface smoothness due to the limited resolution of the lithography mask. The concept proposed in this research uses wedges formed by the 111 planes in a silicon wafer, which is manufactured using a wet etching process.…”

Section: Two-dimensional Fiber Positioning and Clampingmentioning

confidence: 99%

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Two-Dimensional Fiber Positioning and Clamping Device for Product-Internal Microassembly

Henneken

Vlist

Wien

et al. 2008

J. Microelectromech. Syst.

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Abstract-In this paper, we present a microelectromechanical systems-based two-degrees-of-freedom positioning device combined with a clamping structure for positioning and constraining an optical fiber. The fiber position can be controlled in the two directions perpendicular to the fiber axis using two specifically designed wedges that can be accurately moved in-plane. These wedges are positioned using in-plane thermal actuators. Actuation of a fiber tip greater than 25 µm in-plane and 40 µm out-of-plane is achieved with a displacement resolution better than 0.1 µm. After aligning the fiber the final position can be maintained by switching off the mechanical clamp, which also uses thermal actuators. The position of the fiber can be kept within 0.1 µm after switching off the mechanical clamp and the positioning actuator. Fiber-to-fiber alignment experiments have been performed and the technique can be extended to fiber-to-laser alignment.[

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Section: Two-dimensional Fiber Positioning and Clampingmentioning

confidence: 99%

“…Before the dry etching step, the membranes are etched from the backside using a KOH etching process until a 150-µm-thick silicon membrane remains (8). A 500-nm aluminum stop layer for the DRIE process is then deposited on the backside of the wafer.…”

Section: A Positioning Devicesmentioning

confidence: 99%

Two-Dimensional Fiber Positioning and Clamping Device for Product-Internal Microassembly

Henneken

Vlist

Wien

et al. 2008

J. Microelectromech. Syst.

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“…Recently, the positioning stages with a high precision have become an essential component for applications such as manufacturing systems of flat panel display(FPD), semiconductor [1], micro/nano manipulation [2], biological cell manipulation [3], scanning probe microscope(SPM) [4], and optical fiber alignment [5]. Although various stages are used for these applications, the 2-DOF translational stage is seen as the most basic stage.…”

Section: Introductionmentioning

confidence: 99%

Design and implementation of a 2-DOF decoupled kinematic actuator module

Ihn

Moon

Choi

et al. 2012

2012 IEEE/RSJ International Conference on Intelligent Robots and Systems

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This paper presents a comprehensive study on the design and implementation about 2-DOF decoupled kinematic actuator module based on the parallel structure with a high mechanical stiffness. The basic structure of 2-DOF decoupled kinematic actuator module has two motion units. Since one motion unit can be moved in only one direction, various applications are available and it can solve the parasitic motion fundamentally. The two motion units also have fine motion and coarse motion respectively. Besides it can be variously modified based on how the actuators are connected. Then the hardware of 2-DOF decoupled kinematic actuator module is implemented with one actuator and two additional locking devices. And the performance of the hardware will be evaluated by experimental system.

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“…However, with current passive alignment methods, 0.5 -1 µm accurate waveguide to waveguide alignment is about the best that can be achieved [3,4,5]. Frequently, the more time-consuming alternative of active alignment is used when sub-micron accuracy is required [6,7,8,9]. In this paper, we propose design rules to achieve sub-micron accurate passive alignment.…”

Section: Introductionmentioning

confidence: 99%

Design, Fabrication and Testing of Assembly Features for Enabling Sub-micron Accurate Passive Alignment of Photonic Chips on a Silicon Optical Bench

Gurp

Tichem

Staufer

2012

Precision Assembly Technologies and Systems

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Part 1: Micro Assembly Processes and SystemsInternational audienceIn this paper, we report on passive alignment with sub-micron precision of two photonic chips on a silicon optical bench. An effective design principle to minimize the tolerance chain is presented and applied to a case study. The chips have been successfully manufactured and individual characterization of the chips revealed that all critical dimensions were within or close to specs. Sub-pixel analysis of images of assembled chips showed that a repeatability of 0.3 μm from a single photonic chip to the silicon optical bench can be achieved. Moreover, it was demonstrated that passive alignment features defined in the waveguiding layers are robust enough to function as mechanical endstops

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Automated Two-Axes Optical Fiber Alignment Using Grayscale Technology

Cited by 19 publications

References 14 publications

Two-Dimensional Fiber Positioning and Clamping Device for Product-Internal Microassembly

Two-Dimensional Fiber Positioning and Clamping Device for Product-Internal Microassembly

Design and implementation of a 2-DOF decoupled kinematic actuator module

Design, Fabrication and Testing of Assembly Features for Enabling Sub-micron Accurate Passive Alignment of Photonic Chips on a Silicon Optical Bench

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