Ball Grid Array Solder Joint Reliability Under System-Level Compressive Load

Chiu, Tz-Cheng; Edwards, D.; Ahmad, Mudasir

doi:10.1109/tdmr.2010.2049848

Cited by 15 publications

(14 citation statements)

References 7 publications

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“…A slightly benign thermal excursion profile for solder joints in cases with big heat sink than that without a heat sink may lead to the thermal reliability improvement of interconnects [10]. Therefore, a uniform thermal profile should be obtained to eliminate this effect.…”

Section: Thermal Cycling Testmentioning

confidence: 99%

“…Solder collapse, which leads to electrical shorting by bridging to adjacent solder joints, and solder joint fatigue crack were identified as two failure modes for the preloaded solder joints under thermal cycling [10]. A higher compressive loading is desirable as it reduces the interfacial thermal resistance between package and heat sink and increases heat dissipation efficiency.…”

Section: Introductionmentioning

confidence: 99%

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Reliability Assessment of Preloaded Solder Joint Under Thermal Cycling

Yu¹,

Lee²,

Park

2012

Journal of Electronic Packaging

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The ever increasing power density in modern semiconductor devices requires heat dissipation solution such as heat sink to remove heat away from the device. A compressive loading is usually applied to reduce the interfacial thermal resistance between package and heat sink. In this paper, both experimental approaches and numerical modeling were employed to study the effect of compressive loading on the interconnect reliability under thermal cycling conditions. A special loading fixture which simulated the heat sink was designed to apply compressive loading to the package. The JEDEC standard thermal cycle tests were performed and the resistance of daisy chained circuits was in situ measured. The time to crack initiation and time to permanent failure were identified separately based on in situ resistance measurement results. Failure analysis has been performed to identify the failure modes of solder joint with and without the presence of compressive loading. A finite element based thermal-fatigue life prediction model for SAC305 solder joint under compressive loading was also developed to understand the thermal-fatigue crack behaviors of solder joint and successfully validated with the experimental results.

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Section: Thermal Cycling Testmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Reliability Assessment of Preloaded Solder Joint Under Thermal Cycling

Yu¹,

Lee²,

Park

2012

Journal of Electronic Packaging

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“…One of the reliability concerns for solder joints in telecommunication and other high performance computing applications is the heatsink assembly induced BGA solder joint bridging failure [4][5][6]. Heatsinks have been used extensively as heat dissipation solutions for microelectronic packages.…”

Section: Introductionmentioning

confidence: 99%

“…Garner et al [4] investigated the board level reliability for flip-chip BGA package with SnPb solder joints under either temperature cycling fatigue or constant temperature creep condition, with the presence of compressive load. Chiu et al [5] studied the influence of compressive load on board level reliability for SnPbAg solder joints and developed a prediction model for the compressive creep induced reliability failure. Bhatti et al [6] observed that the presence of compressive preload led to the change of critical solder joint failure locations for both SnPb and SnAgCu flip-chip BGA packages under board level temperature cycling conditions.…”

Section: Introductionmentioning

confidence: 99%

“…These studies all observed that the presence of heatsink compression affected solder joint reliability, regardless of the solder materials considered in them. In addition, under higher levels of heatsink compressive load, the typical fatigue cracking induced electrical open failures were retarded, and creep collapse induced solder bridging emerged as the dominant failure mode [4,5].…”

Section: Introductionmentioning

confidence: 99%

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