2011 International Conference on Devices and Communications (ICDeCom) 2011
DOI: 10.1109/icdecom.2011.5738481
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Bandwidth Modelling for Distributed On-Chip RLCG Interconnect Considering Coupling Effects

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Cited by 4 publications
(2 citation statements)
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“…The substrate can be modeled by a two port ʌ-resistance network [7]. Furthermore, other models exist, due to exact occasion of the modeled structure, such as an RLCG two parallel transmission interconnect line model or analytical models such as quasi-static (QS) and magnetic potential (MP) models [8][9]. In this study the extracted z and s parameters will be used for analysis, comparisons and conclusions.…”
Section: Substrate Structuresmentioning
confidence: 98%
“…The substrate can be modeled by a two port ʌ-resistance network [7]. Furthermore, other models exist, due to exact occasion of the modeled structure, such as an RLCG two parallel transmission interconnect line model or analytical models such as quasi-static (QS) and magnetic potential (MP) models [8][9]. In this study the extracted z and s parameters will be used for analysis, comparisons and conclusions.…”
Section: Substrate Structuresmentioning
confidence: 98%
“…Τυπικά, τα μοντέλα των μεταλλικών γραμμών στη βιβλιογραφία περιλαμβάνουν την ηλεκτρομαγνητική σύζευξη δια μέσω του υποστρώματος [16]. Σε αυτή τη παράγραφο μελετώνται δύο παράλληλες μεταλλικές γραμμές στο ANSYS HFSS ακολουθώντας την γεωμετρία και τις ιδιότητες υλικών της τεχνολογίας TSMC 65nm για να μελετηθεί η επίδραση αυτής της σύζευξης σε υψηλές τιμές συχνοτήτων έως 100 GHz.…”
Section: η/μ σύζευξη διασυνδέσεων δια μέσω του υποστρώματοςunclassified