Behavior of Pd/Sn and Pd Catalysts for Electroless Plating on Different Substrates Investigated by Means of Rutherford Backscattering Spectroscopy

Svendsen, L. G.; Osaka, Tetsuya; Sawai, Hideo

doi:10.1149/1.2119562

Cited by 38 publications

(16 citation statements)

References 4 publications

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“…80 [5] 60 rM 20 Wave length / nm Since the discovery of giant magnetoresistance in antiferromagnetically coupled Fe/Cr, Co/Cu multilayers, and other metallic multilayer systems,14 interest in magnetic multilayers has been greatly stimulated. Currently the development of new magnetic multilayered nanostructures has attracted considerable attention for potential applicability to magnetoresistive sensor devices.…”

Section: Resultsmentioning

confidence: 99%

Transparent Zinc Oxide Films Chemically Prepared from Aqueous Solution

Izaki

Omi

1997

J. Electrochem. Soc.

150

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Transparent zinc oxide (ZnO) films had been chemically deposited on nonconductive glass from aqueous solutions containing zinc nitrate and dimethylamine-borane (DMAB) kept at 323 K. The ZnO films had a wurtzite structure and exhibited an optical bandgap energy of 3.3 eV which is characteristic of ZnO. A 0.2 m thick ZnO film with an optical transmittance of 80% was deposited by immersion for approximately 20 mm in an aqueous solution containing 0.05 mol/liter zinc nitrate and 0.05 to 0.1 mol/liter DMAB.

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Section: Resultsmentioning

confidence: 99%

Transparent Zinc Oxide Films Chemically Prepared from Aqueous Solution

Izaki

Omi

1997

J. Electrochem. Soc.

150

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“…The first is the acid functionalization of CNTs, which was found to be unnecessary. The second is the use of a one-step colloidal Pd–Sn catalyzation approach instead of the two-step stannous chloride and palladium chloride solutions approach for surface activation. ,,,, Accordingly, the processing time was reduced significantly.…”

Section: Discussionmentioning

confidence: 99%

Development of an AlCl₃-Urea Ionic Liquid for the Electroless Deposition of Aluminum on Carbon Nanotubes

Elsharkawi

Esawi

2020

ACS Omega

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Unlike the easy electroless deposition of other metals, the deposition of aluminum can be challenging. This is because the standard reduction potential of aluminum lies outside the electrochemical window (EW) of water. Ionic liquids such as AlCl 3 -1-ethyl-3-methylimidazolium chloride (EMIC) have been used because of their wide EW. Here, we introduce a novel ionic liquid for electroless deposition of aluminum by reacting AlCl 3 and urea, with lithium aluminum hydride (LAH) as a reducing agent. Additionally, we report the first successful effort in coating carbon nanotubes (CNTs), as an example of nanostructures with high surface area to volume ratio, with aluminum using electroless deposition. The produced aluminum coating was found to be nanostructured, uniformly covering the CNTs and in close contact with their surfaces.

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“…Previous work using Pd−Sn colloids has shown that sustained EL metallization requires a threshold surface concentration of >10 15 Pd atoms·cm −2 , a value that exceeds levels for monomeric Pd II /ligand SAM complexes. Consequently, metallization processes using simple ligand SAMs, such as those shown in Scheme , will require binding of Pd-based oligomers or colloids to exceed the threshold.…”

Section: El Metal Depositionmentioning

confidence: 98%

Selective Electroless Metallization of Patterned Polymeric Films for Lithography Applications

Zabetakis

Dressick

2009

ACS Appl. Mater. Interfaces

114

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The fabrication of electrical interconnects to provide power for and communication with computers as their component complementary metal oxide semiconductor (CMOS) devices continue to shrink in size presents significant materials and processing compatibility challenges. We describe here our efforts to address these challenges using top-surface imaging and hybrid photoresist/self-assembled monolayer patterning approaches, in conjunction with selective electroless metal deposition, to develop processes capable of fabricating appropriate submicron and nanoscale metal features useful as electrical interconnects, as well as plasma-etch-resistant masks and metal diffusion barriers. Our efforts focus on the development of cost-effective methods compatible with a manufacturing environment that satisfy materials and process constraints associated with CMOS device production. We demonstrate the fabrication of approximately 50-nm-width features in metal with high fidelity and sufficient control of edge acuity to satisfy current industry design rules using our processes and discuss the challenges and opportunities for fabrication of analogous sub-10-nm metal features.

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Behavior of Pd/Sn and Pd Catalysts for Electroless Plating on Different Substrates Investigated by Means of Rutherford Backscattering Spectroscopy

Abstract: ratio of 12/1 be employed for silox CVD processing. (iii)The deposition rate decrease with increased flow of nitrogen is attributed to two factors, depression of the sil,ane partial pressure and lowering of the wafer surface temperature.

Cited by 38 publications

References 4 publications

Transparent Zinc Oxide Films Chemically Prepared from Aqueous Solution

Transparent Zinc Oxide Films Chemically Prepared from Aqueous Solution

Development of an AlCl₃-Urea Ionic Liquid for the Electroless Deposition of Aluminum on Carbon Nanotubes

Selective Electroless Metallization of Patterned Polymeric Films for Lithography Applications

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Behavior of Pd/Sn and Pd Catalysts for Electroless Plating on Different Substrates Investigated by Means of Rutherford Backscattering Spectroscopy

Abstract: ratio of 12/1 be employed for silox CVD processing. (iii)The deposition rate decrease with increased flow of nitrogen is attributed to two factors, depression of the sil,ane partial pressure and lowering of the wafer surface temperature.

Cited by 38 publications

References 4 publications

Transparent Zinc Oxide Films Chemically Prepared from Aqueous Solution

Transparent Zinc Oxide Films Chemically Prepared from Aqueous Solution

Development of an AlCl3-Urea Ionic Liquid for the Electroless Deposition of Aluminum on Carbon Nanotubes

Selective Electroless Metallization of Patterned Polymeric Films for Lithography Applications

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Product

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Development of an AlCl₃-Urea Ionic Liquid for the Electroless Deposition of Aluminum on Carbon Nanotubes