2015
DOI: 10.1016/j.vacuum.2014.12.004
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Benefits of the controlled reactive high-power impulse magnetron sputtering of stoichiometric ZrO2 films

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Cited by 59 publications
(28 citation statements)
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“…which is monitored by the process controller. This feed-back process control is able to maintain a sputter deposition of stoichiometric films in the region between a more and less metallic mode, and to utilize exclusive benefits of the HiPIMS discharges in preparation of films [20]. Fig.…”
Section: Film Preparationmentioning
confidence: 99%
See 1 more Smart Citation
“…which is monitored by the process controller. This feed-back process control is able to maintain a sputter deposition of stoichiometric films in the region between a more and less metallic mode, and to utilize exclusive benefits of the HiPIMS discharges in preparation of films [20]. Fig.…”
Section: Film Preparationmentioning
confidence: 99%
“…The consequently higher mobility of film atoms can naturally increase the column width (46, 38 and 21-24 nm for <S d > = 54, 18 and 7 Wcm -2 , respectively). Second, it leads to higher energy of some of the particles bombarding the growing films (stronger high-energy tail [20]). The energetic bombardment may, for example, destroy (amorphize) some of the crystals soon after their nucleation (see e. g. [25]), opening a larger space for the growth of the remaining ones.…”
Section: Effect Of Deposition Parameters On the Hfo 2 Film Microstrucmentioning
confidence: 99%
“…Magnetron sputtering is a deposition technique that enables the microstructure to be controlled and the physical properties of the films to be tuned [ 14 ]. Reactive magnetron sputtering is popular because it is capable of producing compound films (including MOSs) with various stoichiometries and structures [ 15 , 16 , 17 ]. Among a wide variety of magnetron sputtering techniques, reactive high-power impulse magnetron sputtering (HiPIMS) is a prominent technique for the preparation of high-quality compound films.…”
Section: Introductionmentioning
confidence: 99%
“…The sequential injection of gas portions causes a cyclic change of pressure conditions in the chamber. Before the next pulse of the gas, the pressure is lower than normal, which reduces the number of collisions and energy loss of the particles directed to the substrate [12][13][14][15]. Recently, there has also been some interest in a new modification of the sputtering method called gas impulse magnetron sputtering (GI MS) [16][17][18][19].…”
Section: Introductionmentioning
confidence: 99%