Bonding-Wire-Geometric-Profile-Dependent Model for Mutual Coupling Between Two Bonding Wires on a Glass Substrate

Dinh, Thanh Vinh; Pagazani, Julien; Lesénéchal, Dominique; Pasquet, Daniel; Descamps, Philippe; Lissorgues, Gaëlle; Nicole, Pierre

doi:10.1109/tcpmt.2014.2366730

Cited by 13 publications

(10 citation statements)

References 14 publications

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“…It is worth noting that the thickness of the substrate may affect the mutual inductance between the bonding wire and the ground, and the critical value is about 500 μm. 5 To avoid influence, the modeling method proposed in this article is suitable for substrate thicknesses greater than 500 μm. The value of the equivalent resistor and the value of the equivalent capacitor can be expressed as (4) and (5), respectively.…”

Section: Single-bondwirementioning

confidence: 99%

“…In addition, the geometry of the bondwires has an impact on the equivalent circuit model. Therefore, there is a certain error in each component value obtained according to (1) to (5).…”

Section: Single-bondwirementioning

confidence: 99%

“…To avoid effects of distributed ground plane, the thickness of all PCBs measured is 20 mil to ensure that the distance between the bondwire and the reference ground is greater than 500 μm. 5 The test platform is shown in Figure 11. The PCB is fixed by the fixture, and the test result is obtained by the automatic test program based on Python.…”

Section: Measured Comparisonmentioning

confidence: 99%

“…Many researches have been conducted on the transmission characteristics of bondwires. [1][2][3][4][5][6][7][8] In Reference 1, a finite-difference time-domain (FDTD) method is proposed for the rigorous analysis of bondwire's modeling and electrical characterization. In addition, a quasistatic model was proposed and proved its practicality.…”

Section: Introductionmentioning

confidence: 99%

“…Based on which, 3 proposed an improved model of bondwires, taking into account the skin effect. 4,5 extend the equivalent model research to the double-bondwire in Reference 6, the relationship between materials with different dielectric constant and return loss were investigated. In Reference 7, the influence of the platform length, diameter, span, bonding height parameters and the loops of bondwire is discussed in relation to the S parameters.…”

Section: Introductionmentioning

confidence: 99%

See 4 more Smart Citations

Study of harmonic control power amplifier technology based on improved modeling of bondwire

Zhong

Song

et al. 2022

Int J RF Mic Comp-Aid Eng

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Wire bonding is widely used in various radio frequency (RF) devices and is one of the common forms of signal interconnection. In this article, a new geometric model with related physical parameters is used to describe various actual types of the bondwire, and the corresponding calculation method for the total length of the bondwire is obtained. Consequently, a new equivalent circuit modeling method of the single‐bondwire can be developed and the accuracy of model has been improved. On this basis, using the concept of partial inductance, the modeling method of double‐bondwire is proposed, which can be applied to asymmetric double‐bondwire modeling. The model of bondwire obtained by this modeling method is applied to the design of PA, and the special electrical properties of the bondwire are used to verify a novel harmonic control method, which second and third harmonics could be controlled. The results show that in the Sub‐6G, the proposed bondwire model has good accuracy, and its performance is close to the measured results. The designed PA combined with harmonic control network has good performance, achieving drain efficiency of 62.6%–70% and output power of 40–41.5 dBm at 3.2–3.8 GHz. It is proved that the proposed bonding line modeling method can be applied to the design of high‐efficient PA.

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Section: Single-bondwirementioning

confidence: 99%

“…In addition, the geometry of the bondwires has an impact on the equivalent circuit model. Therefore, there is a certain error in each component value obtained according to (1) to (5).…”

Section: Single-bondwirementioning

confidence: 99%

Section: Measured Comparisonmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Study of harmonic control power amplifier technology based on improved modeling of bondwire

Zhong

Song

et al. 2022

Int J RF Mic Comp-Aid Eng

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Packaging Technologies

Ye¹

2020

Antenna‐in‐Package Technology and Applications

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Parasitic Effects Analysis of Bonding Wires Bonding Parameter of Intelligent Power Modules for Three-Phase Motor Control Applications

Wang

Zheng

Wang

et al. 2020

J. Phys.: Conf. Ser.

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Parasitic parameter analysis is the focus of intelligent power module switch performance research. This paper will utilize the model of 600V/30A intelligent power module and extract the part of circuit layout bonding wires parasitic parameter by Ansys Q3D Extractor, expedition the relationship between physical bonding parameter and parasitic parameter in the intelligent power module circuit. An exact three-phase circuit module of high voltage intelligent power module and bonding wires package module is established. Through Ansys Q3D Extractor, test a series of bonding parameters from the three-phase circuit layout module and extract the parasitic parameters of the bonding wires. The experimental results of the parasitic parameters are analysed and compared, and the influence degree of the bonding parameters on the parasitic parameters is discussed. An improved solution is proposed for the bonding wires of the intelligent power module to reduce the voltage spike that the MOSFET chip during the turn-off process.

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Bonding-Wire-Geometric-Profile-Dependent Model for Mutual Coupling Between Two Bonding Wires on a Glass Substrate

Cited by 13 publications

References 14 publications

Study of harmonic control power amplifier technology based on improved modeling of bondwire

Study of harmonic control power amplifier technology based on improved modeling of bondwire

Packaging Technologies

Parasitic Effects Analysis of Bonding Wires Bonding Parameter of Intelligent Power Modules for Three-Phase Motor Control Applications

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