Breakthrough development of ultimate ultra-fine pitch process with gold wire & copper wire in QFN packages

Approaching Gas Phase Electrodeposition: Process and Optimization to Enable the Self‐Aligned Growth of 3D Nanobridge‐Based Interconnects

“…[1][2][3] Freeform wires known at the macroscopic scale take on the shape of bondwires at the submilimeter scale, connecting chip-sized objects using wire diameters and contact pads, which can be as small as 10 and 20 µm, respectively. [ 4 ] An extension of free-standing point-to-point wiring to a truly microscopic or even nanoscopic scale, however, remains challenging. For example, a nanowire bonding process similar to what will be discussed does not yet exist.…”