BTA Copper Complexes

Friedrich, M.; Gálvez-Ruíz, Juan Carlos; Klapötke, Thomas M.; Mayer, Péter; Weber, Birgit; Weigand, Jan J.

doi:10.1021/ic050657r

Cited by 185 publications

(108 citation statements)

References 32 publications

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“…BTA-Liganden können durch eine Methode von Naud et al hergestellt werden [112] (siehe auch die Synthesen von Friedrich et al und Klapötke et al [90,94] ). Hierbei wird zunächst Natriumdicyanamid mit Natriumazid (das zu einem pK S von weniger als 1 angesäuert wird) zu Natriumbistetrazolamin (NaBTA) umgesetzt.…”

Section: Synthese Von Metall-bta-komplexenunclassified

Nanoporöse Metallschäume

2010

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Nanoporöse Metallschäume (NMFs) werden seit langem als eine Klasse von Stoffen für leitfähige und katalytische Materialien mit großen Oberflächen untersucht. Dieser Aufsatz gibt einen Überblick über neue Strategien für die Herstellung von NMFs mit einem Schwerpunkt auf der Verbrennungssynthese und diskutiert aktuelle Anwendung von NMFs, unter anderem zur Speicherung von Wasserstoff und in der Katalyse.

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Section: Synthese Von Metall-bta-komplexenunclassified

Nanoporöse Metallschäume

2010

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“…[16] Recently, copper complexes of N,N-bis-(1 (2)H-tetrazol-5-yl)amine (H 2 Bta) (1) were reported. [17] The acidic protons of H 2 Bta enable the formation of the corresponding salts by reactions with nitrogen-rich bases. Although there are several reports of Bta salts, most of them appear in patents or unpublished documents.…”

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confidence: 99%

“…The few structurally characterized Bta structures in the Cambridge Database [27] consist of metal salts in which the Bta geometry in the dianion is distorted. [17,28] However, it is clear from all the structures that the metals coordinate mainly to the N7 and N8 positions (numbering in 7) which in 7 form some of the strongest (i.e., shortest) hydrogen bonds and also close interactions with the cations.…”

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Energetic Nitrogen Rich Salts of N,N‐bis[1(2)H‐Tetrazol‐5‐yl]amine

et al. 2007

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Modern high-energy density materials (HEDM), where energetic nitrogen rich salts are among the most recent and exciting developments, continue to attract considerable interest. [1][2][3][4][5][6] The use of nitrogen-containing anions and cations contributes to high heats of formation and high densities arising from the large number of inherently energetic N-N and C-N bonds. Salt-based energetic materials often possess advantages over non-ionic molecules since these salts tend to exhibit lower vapor pressures and higher densities than their atomically similar non-ionic analogues.The decomposition of these compounds results predominantly in the generation of dinitrogen which makes them very promising candidates for applications requiring environmentally friendly highly energetic materials. Syntheses of these energetic salts involve the combination of unique cations and anions containing energetic functionalities. Most of the cations are based on bulky organic species with high nitrogen-containing heterocycles predominating, such as triazole, tetrazole, triazine, and tetrazine. Most frequently the anion is inorganic, such as nitrate, perchlorate, and dinitramide.

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“…[26][27][28] The first layer is the Cu oxide layer. The nature of the Cu oxide under-layer will definitely influence the adsorption of BTA.…”

Section: Resultsmentioning

confidence: 99%

Galvanic Corrosion Inhibitors for Cu/Ru Couple during Chemical Mechanical Polishing of Ru

Cheng

Wang

2016

ECS J. Solid State Sci. Technol.

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Galvanic corrosion of Cu is a critical issue during the chemical mechanical polishing (CMP) process of barrier layer, especially when KIO 4 is used as the oxidant in the polishing slurry. This paper focuses on the investigation of galvanic corrosion inhibitors (BTA and 1, 2, 4-triazole) for Cu/Ru couple in the KIO 4 -based solutions. The galvanic corrosion current of Cu was directly measured, and the corrosion inhibition efficiencies (CIE) were calculated. Results show that both BTA and 1, 2, 4-triazole are effective galvanic corrosion inhibitors of Cu. The CIE of 5 mM BTA and 2 mM 1, 2, 4-triazole is up to 69.4 and 59.7, respectively. On this basis, the corrosion inhibition mechanism was proposed. BTA forms a complete and tight three-dimensional multilayer structure on Cu when the concentration is over 0.5 mM. With regard to 1, 2, 4-triazole, the protective film on Cu is two-dimensional, and excessive dosage of 1, 2, 4-triazole will reduce the stability of the surface film, as well as the corrosion inhibition efficiency of Cu. © 2016 The Electrochemical Society. [DOI: 10.1149/2.0181701jss] All rights reserved.Manuscript submitted November 1, 2016; revised manuscript received December 7, 2016. Published December 30, 2016 Corrosion plays a critical role in diverse industrial fields, and consequently, in the chemical mechanical polishing process (CMP) of the chip manufacturing process. During the CMP process, dissimilar metal surfaces are exposed to the polishing solutions, which could provide electrolyte-conducting paths for the corrosion and galvanic corrosion between Cu wiring and the directly contacting barrier metals. Ruthenium (Ru), a novel barrier layer material, the application of which is quite promising in the new generation of integrated circuit. 1A thin film of Ru (several nanometers) often lies between Cu and the low-k dielectric material, preventing interfacial diffusion between Cu and the substrate.2,3 Since the polishing solutions used in the CMP process are corrosive and abrasive, the galvanic corrosion at the Cu/Ru interface is unavoidable and detrimental. It has been reported that the resulting interfacial defects from galvanic corrosion could cause severe Cu pitting and dishing problems, and even affect the reliability of Cu interconnection. 4 Galvanic corrosion refers to the accelerated corrosion of Cu when connected with Ru, occurring at the mixed potential between the corrosion potentials of Cu and Ru under uncoupled conditions. Ru is much nobler than Cu, thus acting as the cathode and Cu acting as the anode, comparatively. It is commonly recognized that a bigger corrosion potential difference ( E cor ) between two metals will cause a serious trend of galvanic corrosion, and therefore a minimizing E cor is the goal when evaluating the corrosion inhibition effect of various inhibitors in most of the relevant researches.5-7 However, practical corrosion process is influenced by many other factors such as the area ratio of anode/cathode, and the properties of the surface passive film. 8,9 Theref...

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BTA Copper Complexes

Cited by 185 publications

References 32 publications

Nanoporöse Metallschäume

Nanoporöse Metallschäume

Energetic Nitrogen Rich Salts of N,N‐bis[1(2)H‐Tetrazol‐5‐yl]amine

Galvanic Corrosion Inhibitors for Cu/Ru Couple during Chemical Mechanical Polishing of Ru

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